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NTB125N02R_06 PDF预览

NTB125N02R_06

更新时间: 2024-09-30 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 85K
描述
Power MOSFET 125 A, 24 V N−Channel TO−220, D2PAK

NTB125N02R_06 数据手册

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NTB125N02R, NTP125N02R  
Power MOSFET  
125 A, 24 V N−Channel  
TO−220, D2PAK  
Features  
Planar HD3e Process for Fast Switching Performance  
Body Diode for Low t and Q and Optimized for Synchronous  
http://onsemi.com  
rr  
rr  
Operation  
125 AMPERES, 24 VOLTS  
Low C to Minimize Driver Loss  
iss  
RDS(on) = 3.7 mW (Typ)  
Optimized Q and R  
for Shoot−through Protection  
gd  
DS(on)  
Low Gate Charge  
Pb−Free Packages are Available  
D
MAXIMUM RATINGS (T = 25°C Unless otherwise specified)  
J
G
Parameter  
Drain−to−Source Voltage  
Symbol Value Unit  
V
24  
20  
V
V
DSS  
dc  
S
Gate−to−Source Voltage − Continuous  
Thermal Resistance − Junction−to−Case  
V
GS  
dc  
R
P
1.1  
113.6  
°C/W  
W
q
JC  
MARKING  
DIAGRAMS  
Total Power Dissipation @ T = 25°C  
C
D
Drain Current −  
Continuous @ T = 25°C, Chip  
I
125  
120.5  
95  
A
A
A
A
4
C
D
Continuous @ T = 25°C, Limited by Package  
I
I
I
C
D
D
D
Continuous @ T = 25°C, Limited by Wires  
A
Single Pulse (t = 10 ms)  
250  
p
TO−220AB  
CASE 221A  
STYLE 5  
Thermal Resistance −  
Junction−to−Ambient (Note 1)  
Total Power Dissipation @ T = 25°C  
Drain Current − Continuous @ T = 25°C  
125N2RG  
AYWW  
R
P
I
46  
2.72  
18.6  
°C/W  
W
A
q
JA  
A
D
A
D
Thermal Resistance −  
Junction−to−Ambient (Note 2)  
Total Power Dissipation @ T = 25°C  
Drain Current − Continuous @ T = 25°C  
1
R
P
I
63  
1.98  
15.9  
°C/W  
W
A
q
JA  
2
2
A
D
3
3
A
D
Operating and Storage Temperature Range  
T , T  
−55 to  
150  
°C  
J
stg  
125N2G  
AYWW  
2
4
D PAK  
Single Pulse Drain−to−Source Avalanche  
E
AS  
120  
mJ  
CASE 418AA  
STYLE 2  
Energy − Starting T = 25°C  
J
1
(V = 50 V , V = 10 V , I = 15.5 A ,  
DD  
dc  
GS  
dc  
L
pk  
L = 1 mH, R = 25 W)  
G
Maximum Lead Temperature for Soldering  
Purposes, 1/8from Case for 10 Seconds  
T
L
260  
°C  
125N2x = Device Code  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
x
= R  
A
Y
= Assembly Location  
= Year  
WW  
G
= Work Week  
= Pb−Free Package  
1. When surface mounted to an FR4 board using 1 inch pad size,  
2
(Cu Area 1.127 in ).  
2. When surface mounted to an FR4 board using minimum recommended pad  
2
size, (Cu Area 0.412 in ).  
PIN ASSIGNMENT  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
PIN  
1
FUNCTION  
Gate  
2
Drain  
3
Source  
Drain  
4
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
April, 2006 − Rev. 7  
NTB125N02R/D  
 

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