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NTB125N02R PDF预览

NTB125N02R

更新时间: 2024-01-15 05:10:28
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 72K
描述
Power MOSFET 125 A, 24 V N-Channel TO-220, D2PAK

NTB125N02R 技术参数

是否无铅:不含铅生命周期:Obsolete
包装说明:LEAD FREE, CASE 418AA-01, D2PAK-3针数:3
Reach Compliance Code:not_compliantHTS代码:8541.29.00.95
风险等级:5.43Is Samacsys:N
雪崩能效等级(Eas):120 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:25 V
最大漏极电流 (Abs) (ID):125 A最大漏极电流 (ID):95 A
最大漏源导通电阻:0.0062 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):113.6 W最大脉冲漏极电流 (IDM):250 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTB125N02R 数据手册

 浏览型号NTB125N02R的Datasheet PDF文件第2页浏览型号NTB125N02R的Datasheet PDF文件第3页浏览型号NTB125N02R的Datasheet PDF文件第4页浏览型号NTB125N02R的Datasheet PDF文件第5页浏览型号NTB125N02R的Datasheet PDF文件第6页 
NTB125N02R, NTP125N02R  
Power MOSFET  
125 A, 24 V N−Channel  
TO−220, D2PAK  
Features  
http://onsemi.com  
Planar HD3e Process for Fast Switching Performance  
Body Diode for Low t and Q and Optimized for Synchronous  
rr  
rr  
Operation  
125 AMPERES, 24 VOLTS  
Low C to Minimize Driver Loss  
iss  
RDS(on) = 3.7 mW (Typ)  
Optimized Q and R  
for Shoot−through Protection  
gd  
DS(on)  
Low Gate Charge  
D
MAXIMUM RATINGS (T = 25°C Unless otherwise specified)  
J
Parameter  
Drain−to−Source Voltage  
Symbol Value Unit  
G
V
DSS  
24  
V
dc  
V
dc  
Gate−to−Source Voltage − Continuous  
V
GS  
±20  
S
Thermal Resistance − Junction−to−Case  
R
P
1.1  
113.6  
°C/W  
W
q
JC  
Total Power Dissipation @ T = 25°C  
C
D
MARKING  
Drain Current −  
Continuous @ T = 25°C, Chip  
I
125  
120.5  
95  
A
A
A
A
DIAGRAMS  
C
D
Continuous @ T = 25°C, Limited by Package  
I
I
I
C
D
D
D
Continuous @ T = 25°C, Limited by Wires  
A
Single Pulse (t = 10 ms)  
250  
p
TO−220AB  
CASE 221A  
STYLE 5  
4
125N2R  
YWW  
Thermal Resistance −  
Junction−to−Ambient (Note 1)  
R
46  
2.72  
18.6  
°C/W  
W
A
q
JA  
Total Power Dissipation @ T = 25°C  
P
A
D
Drain Current − Continuous @ T = 25°C  
I
D
A
Thermal Resistance −  
Junction−to−Ambient (Note 2)  
Total Power Dissipation @ T = 25°C  
Drain Current − Continuous @ T = 25°C  
R
P
I
63  
1.98  
15.9  
°C/W  
W
A
q
JA  
1
2
A
D
3
A
D
Operating and Storage Temperature Range  
Single Pulse Drain−to−Source Avalanche  
T , T  
−55 to  
150  
°C  
J
stg  
2
125N2  
D PAK  
4
E
AS  
120  
mJ  
CASE 418AA  
STYLE 2  
YWW  
Energy − Starting T = 25°C  
J
2
(V = 50 V , V = 10 V , I = 15.5 A ,  
DD  
dc  
GS  
dc  
L
pk  
1
L = 1 mH, R = 25 W)  
3
G
Maximum Lead Temperature for Soldering  
T
L
260  
°C  
Purposes, 1/8from Case for 10 Seconds  
125N2 = Specific Device Code  
Y
WW  
= Year  
= Work Week  
1. When surface mounted to an FR4 board using 1 inch pad size,  
2
(Cu Area 1.127 in ).  
2. When surface mounted to an FR4 board using minimum recommended pad  
2
size, (Cu Area 0.412 in ).  
ORDERING INFORMATION  
Device  
Package  
Shipping  
PIN ASSIGNMENT  
2
NTB125N02R  
D PAK  
50 Units/Rail  
PIN  
1
FUNCTION  
Gate  
2
NTB125N02RT4  
D PAK  
800/Tape & Reel  
NTP125N02R  
TO−220AB  
50 Units/Rail  
2
Drain  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
3
Source  
Drain  
4
Semiconductor Components Industries, LLC, 2003  
1
Publication Order Number:  
October, 2003 − Rev. 4  
NTB125N02R/D  
 

NTB125N02R 替代型号

型号 品牌 替代类型 描述 数据表
NTB125N02RG ONSEMI

完全替代

Power MOSFET 125 A, 24 V N−Channel TO−220, D2PAK
NTB125N02RT4 ONSEMI

完全替代

Power MOSFET 125 A, 24 V N-Channel TO-220, D2PAK
NTB125N02RT4G ONSEMI

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Power MOSFET 125 A, 24 V N−Channel TO−220, D2PAK

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