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NSVBC114EDXV6T1G PDF预览

NSVBC114EDXV6T1G

更新时间: 2024-10-02 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI 小信号双极晶体管数字晶体管
页数 文件大小 规格书
7页 121K
描述
双 NPN 双极数字晶体管 (BRT)

NSVBC114EDXV6T1G 数据手册

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NSBC114EDP6T5G Series  
Preferred Devices  
Dual Digital Transistors  
(BRT)  
NPN Silicon Surface Mount Transistors  
with Monolithic Bias Resistor Network  
http://onsemi.com  
This new series of digital transistors is designed to replace a single  
device and its external resistor bias network. The digital transistor  
contains a single transistor with a monolithic bias network consisting  
of two resistors; a series base resistor and a baseemitter resistor. The  
digital transistor eliminates these individual components by  
integrating them into a single device. The use of a digital transistor can  
reduce both system cost and board space. The device is housed in the  
SOT963 package which is designed for low power surface mount  
applications.  
NPN SILICON DIGITAL  
TRANSISTORS  
(3)  
(2)  
(1)  
R
1
R
2
Q
1
Features  
Q
2
Simplifies Circuit Design  
R
2
R
1
Reduces Board Space  
(4)  
(5)  
(6)  
Reduces Component Count  
The SOT963 Package can be Soldered using Wave or Reflow.  
Available in 4 mm, 8000 Unit Tape & Reel  
These are PbFree Devices  
MARKING  
DIAGRAM  
These are HalideFree Devices  
XM  
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
SOT963  
CASE 527AD  
A
Rating  
Collector-Base Voltage  
Collector-Emitter Voltage  
Collector Current  
Symbol  
Value  
50  
Unit  
Vdc  
V
CBO  
V
CEO  
X
M
G
= Specific Device Code  
= Date Code  
= PbFree Package  
50  
Vdc  
I
C
100  
mAdc  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
ORDERING INFORMATION  
Device  
NSBC114EDP6T5G  
Package  
Shipping  
SOT963  
(PbFree)  
8000 /  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking table  
on page 2 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
September, 2008 Rev. 2  
NSBC114EDP6/D  

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