Datasheet > NSVBC847BDW1T2G

NSVBC847BDW1T2G

更新时间： 2024-10-01 12:32:59

品牌	Logo	应用领域
安森美 - ONSEMI		晶体晶体管
页数	文件大小	规格书
11页	144K
描述
Dual General Purpose Transistors

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中文翻译

获取价格

数据手册

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NSVBC847BDW1T2G 数据手册

BC846BDW1T1G,

SBC846BDW1T1G,

BC847BDW1T1G,

SBC847BDW1T1G Series,

NSVBC847BDW1T2G,

BC848CDW1T1G

http://onsemi.com

Dual General Purpose

Transistors

NPN Duals

SOT−363

CASE 419B

STYLE 1

These transistors are designed for general purpose amplifier

applications. They are housed in the SOT−363/SC−88 which is

designed for low power surface mount applications.

(3)

(2)

(1)

Features

• S and NSV Prefixes for Automotive and Other Applications

Requiring Unique Site and Control Change Requirements;

AEC−Q101 Qualified and PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant*

(4)

(5)

(6)

MARKING DIAGRAM

MAXIMUM RATINGS

1x MG

Rating

Symbol BC846 BC847 BC848 Unit

Collector−Emitter Voltage

Collector−Base Voltage

Emitter−Base Voltage

CEO

CBO

EBO

6.0

100

6.0

100

5.0

100

1x = Specific Device Code

= B, F, G, L

M = Date Code

Collector Current −

Continuous

mAdc

= Pb−Free Package

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

(Note: Microdot may be in either location)

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 6 of this data sheet.

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Total Device Dissipation Per Device

FR−5 Board (Note 1)

380

250

3.0

mW/°C

T = 25°C

Derate Above 25°C

Thermal Resistance,

Junction to Ambient

°C/W

328

Junction and Storage Temperature

Range

T , T

−55 to +150

°C

stg

1. FR−5 = 1.0 x 0.75 x 0.062 in

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Publication Order Number:

September, 2012 − Rev. 9

BC846BDW1T1/D

12 3 4 5 6 7...11

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