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NLV14174BDR2G PDF预览

NLV14174BDR2G

更新时间： 2024-11-10 11:01:43
品牌 Logo 应用领域
安森美 - ONSEMI 触发器锁存器
页数 文件大小 规格书
5页 108K
描述
六路 D 类触发器

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NLV14174BDR2G 数据手册

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MC14174B  
Hex Type D Flip−Flop  
The MC14174B hex type D flip−flop is constructed with MOS  
P−channel and N−channel enhancement mode devices in a single  
monolithic structure. Data on the D inputs which meets the setup time  
requirements is transferred to the Q outputs on the positive edge of the  
clock pulse. All six flip−flops share common clock and reset inputs.  
The reset is active low, and independent of the clock.  
http://onsemi.com  
Features  
MARKING  
DIAGRAMS  
• Static Operation  
• All Inputs and Outputs Buffered  
• Diode Protection on All Inputs  
• Supply Voltage Range = 3.0 Vdc to 18 Vdc  
16  
PDIP−16  
P SUFFIX  
CASE 648  
MC14174BCP  
AWLYYWWG  
1
• Capable of Driving Two Low−Power TTL Loads or One Low−Power  
Schottky TTL Load Over the Rated Temperature Range  
• Functional Equivalent to TTL 74174  
1
• Pb−Free Packages are Available*  
16  
SOIC−16  
D SUFFIX  
CASE 751B  
14174BG  
AWLYWW  
MAXIMUM RATINGS (Voltages Referenced to V  
)
SS  
1
1
Parameter  
Symbol  
Value  
Unit  
V
DC Supply Voltage Range  
V
DD  
−0.5 to +18.0  
Input or Output Voltage Range  
(DC or Transient)  
V , V  
−0.5 to V  
+ 0.5  
V
in out  
DD  
A
= Assembly Location  
WL = Wafer Lot  
YY, Y = Year  
WW = Work Week  
Input or Output Current (DC or Transient)  
per Pin  
I , I  
in out  
10  
mA  
G
= Pb−Free Package  
Power Dissipation, per Package (Note 1)  
Ambient Temperature Range  
P
500  
mW  
°C  
D
T
A
−55 to +125  
−65 to +150  
260  
ORDERING INFORMATION  
Storage Temperature Range  
°C  
†
Device  
Package  
Shipping  
Lead Temperature (8−Second Soldering)  
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Temperature Derating: Plastic “P and D/DW”  
MC14174BCP  
PDIP−16  
25 Units/Rail  
25 Units/Rail  
MC14174BCPG  
PDIP−16  
(Pb−Free)  
Packages: – 7.0 mW/_C From 65_C To 125_C  
MC14174BD  
SOIC−16  
48 Units/Rail  
48 Units/Rail  
This device contains protection circuitry to guard against damage due to high  
static voltages or electric fields. However, precautions must be taken to avoid  
applications of any voltage higher than maximum rated voltages to this  
MC14174BDG  
SOIC−16  
(Pb−Free)  
high−impedance circuit. For proper operation, V and V should be constrained  
MC14174BDR2  
SOIC−16  
2500/Tape & Reel  
2500/Tape & Reel  
in  
out  
to the range V v (V or V ) v V  
.
SS  
in  
out  
DD  
MC14174BDR2G SOIC−16  
(Pb−Free)  
Unused inputs must always be tied to an appropriate logic voltage level  
(e.g., either V or V ). Unused outputs must be left open.  
SS  
DD  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
June, 2006 − Rev. 6  
MC14174B/D  
 
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