DATA SHEET
www.onsemi.com
High Speed Half-Bridge
Driver for GaN Power
Switches
QFN15 4x4, 0.5P
CASE 485FN
NCP51810
The NCP51810 high−speed, gate driver is designed to meet the
stringent requirements of driving enhancement mode (e−mode), high
electron mobility transistor (HEMT), gallium nitrade (GaN) power
switches in medium−voltage half−bridge DC−DC application. The
NCP51810 offers short and matched propagation delays with
advanced level shift technology providing −3.5 V to +150 V (typical)
common mode voltage range for the high−side drive and −3.5 V to
+3.5 V common mode voltage range for the low−side drive. In
addition, the device provides stable dV/dt operation rated up to 200
V/ns for both driver output stages in high speed switching
applications.
To fully protect the gate of the GaN power transistor against
excessive voltage stress, both drive stages employ a dedicated voltage
regulator to accurately maintain the gate−source drive signal
amplitude. The circuit actively regulates the driver’s bias rails and thus
protects against potential gate−source over−voltage under various
operating conditions.
MARKING DIAGRAM
51810A
ALYW G
G
51810A = Specific Device Code
A
L
YW
G
= Assembly Site
= Wafer Lot Number
= Assembly Start Week
= Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
The NCP51810 offers important protection functions such as
independent under−voltage lockout (UVLO), monitoring VDD bias
voltage and VDDH and VDDL driver bias and thermal shutdown
based on die junction temperature of the device. Programmable
dead−time control can be configured to prevent cross−conduction.
VDDH
1
2
3
4
13 EN
12 HIN
11 LIN
HOSRC
HOSNK
SW
Features
NCP51810
(Top View)
• 150 V, Integrated High−Side and Low−Side Gate Drivers
• UVLO Protections for VDD High and Low−Side Drivers
• Dual TTL Compatible Schmitt Trigger Inputs
• Split Output Allows Independent Turn−ON/Turn−OFF Adjustment
• Source Capability: 1 A; Sink Capability: 2 A
• Separated HO and LO Driver Output Stages
• 1 ns Rise and Fall Times Optimized for GaN Devices
• SW and PGND: Negative Voltage Transient up to 3.5 V
• 200 V/ns dV/dt Rating for all SW and PGND Referenced Circuitry
• Maximum Propagation Delay of Less Than 50 ns
• Matched Propagation Delays to Less Than 5 ns
• User Programmable Dead−Time Control
10 SGND
9
DT
ORDERING INFORMATION
†
Device
NCP51810AMNTWG
Package
Shipping
QFN15
(Pb−Free)
4000 / Tape
& Reel
• Thermal Shutdown (TSD)
Typical Applications
• Driving GaN Power Transistors used in Full or Half−Bridge, LLC,
Active Clamp Flyback or Forward and Synchronous Rectifier
Topologies
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
• 48 V to 12 V PoL Converters, 48 V to Low Voltage Bus Converter,
Industrial Modules
© Semiconductor Components Industries, LLC, 2019
1
Publication Order Number:
May, 2022 − Rev. 3
NCP51810/D