NCP5201
Dual Output
DDR Power Controller
The NCP5201 Dual DDR Power Controller is specifically
designed as a total power solution for a high current DDR memory
system. This IC combines the efficiency of a PWM controller for the
VDDQ supply with the simplicity of a linear regulator for the VTT
memory termination voltage. The secondary regulator (VTT) is
designed to automatically track at half the primary regulator voltage
(VDDQ). An internal power good voltage monitor tracks both
VDDQ and VTT outputs and notifies the user in the event of a fault
on either output. Protective features include soft−start circuitry and
undervoltage monitoring of VCC and VSTBY. The IC is packaged in
a 5 × 6 QFN−18.
http://onsemi.com
MARKING
DIAGRAM
1
1
NCP5201
AWLYYWW G
G
Features
18−LEAD QFN, 5 x 6 mm
MN SUFFIX
• Incorporates VDDQ, VTT Regulators
• Internal Switching Standby Regulator for VDDQ
• All External Power MOSFETs Are N−Channel
• Adjustable VDDQ
CASE 505
A
= Assembly Location
WL = Wafer Lot
YY = Year
• VTT Tracks VDDQ/2
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
• Fixed Switching Frequency of 250 kHz for VDDQ in Normal Mode
• Doubled Switching Frequency (500 kHz) for Standby Mode
• Soft−Start Protection for VDDQ
PIN CONNECTIONS
• Undervoltage Monitor
• Short−Circuit Protection for Both VDDQ and VTT Outputs
• Housed in a space saving 5 × 6 QFN−18
• Pb−Free Packages are Available*
FBDDQ
FBVTT
PGND
VSTBY
VTT
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
SS
COMP
VCC
TGDDQ
BGDDQ
SDDQ
AGND
S3_EN
PWRGD
Typical Applications
VTT
• DDR Termination Voltage
• Active Termination Busses (SSTL−2, SSTL−3)
OCDDQ
VDDQ
NC
NOTE: Pin 19 is the thermal pad on the bottom of
the device.
ORDERING INFORMATION
†
Device
NCP5201MN
NCP5201MNG
Package
Shipping
18−Lead QFN
61 Units / Rail
61 Units / Rail
18−Lead QFN
(Pb−Free)
NCP5201MNR2
18−Lead QFN 2500/Tape & Reel
NCP5201MNR2G 18−Lead QFN 2500/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
downloadthe ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
April, 2006 − Rev. 11
NCP5201/D