NCP5209
Product Preview
4−In−1 PWM Buck and
Tri−Linear DDR Power
Controller
http://onsemi.com
MARKING
The NCP5209 4−In−1 PWM Buck and Tri−Linear Power Controller
is a complete ACPI compliant power solution for MCH and DDR
memory. This IC combines the high efficiency of a PWM controller
for the VDDQ supply with the simplicity of linear regulator for the
VTT termination voltage as well as the MCH core supply voltage.
This IC contains a synchronous PWM buck controller for driving
two external NFETs to form the DDR memory supply voltage
(VDDQ). The DDR memory termination regulator (VTT) is designed
to track at the half of reference voltage while sourcing and sinking
current. The two linear regulator controllers driving two external
NFETs are cascaded to produce the MCH core voltage (VMCH).
Protective features include, soft−start circuitry, under−voltage
monitoring of 5VDUAL, 5VATX and 12VATX, and thermal
shutdown. The IC is packaged in a QFN−20.
DIAGRAM
20
NCP5209
1
AWLYYWW
20−LEAD QFN
MN SUFFIX
CASE 505AB
1
NCP5209= Specific Device Code
A
= Assembly Location
= Wafer Lot
= Year
WL
YY
WW
= Work Week
Features
• Synchronous PWM Buck Controller for VDDQ
• Integrated Power FETs with VTT Regulator Source/Sink up to 2.0 A
• Two Linear Regulator Drivers for VMCH
• All External Power MOSFETs are N−Channel
• Adjustable VDDQ and VMCH by External Dividers
• VTT Tracks at Half the Reference Voltage or can be Adjusted
Externally
PIN CONNECTIONS
COMP
SW_DDQ
BG_DDQ
TG_TDQ
BOOT
FBDDQ
SS
PGND
VTT
5VDUAL
OCDDQ
BUF_Cut
DRV_2P4
FB2P4
VDDQ
• Fixed Switching Frequency of 250 kHz for DDQ Regulator in
Normal Mode Doubled switching frequency (500 kHz) for DDQ
Regulator in Standby Mode
AGND
FBVTT
DDQ_REF
FB1P5
DRV_1P5
• Soft−Start Protection for all Regulators
• Under−Voltage Monitoring of Supply Voltages
• Over−Current Protection for DDQ and VTT Regulators
• Fully Complies with ACPI Power Sequencing Specifications
• Protects against Reverse DIMM Insertion
• Thermal Shutdown
NOTE: Pin 21 is the thermal pad
on the bottom of the device.
ORDERING INFORMATION
Device
NCP5209MN
Package
Shipping†
Rail
• Housed in QFN−20
20−Lead QFN*
Applications
NCP5209MNR2 20−Lead QFN* Tape and Reel
*5 x 6 mm
• DDR I and DDR II Memory and MCH Power Supply
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
Semiconductor Components Industries, LLC, 2003
1
Publication Order Number:
December, 2003 − Rev. P1
NCP5209/D