MTD6N20E
Preferred Device
Power MOSFET
6 Amps, 200 Volts
N−Channel DPAK
This advanced Power MOSFET is designed to withstand high
energy in the avalanche and commutation modes. The new energy
efficient design also offers a drain−to−source diode with a fast
recovery time. Designed for low voltage, high speed switching
applications in power supplies, converters and PWM motor controls,
these devices are particularly well suited for bridge circuits where
diode speed and commutating safe operating areas are critical and
offer additional safety margin against unexpected voltage transients.
http://onsemi.com
6 AMPERES, 200 VOLTS
RDS(on) = 460 mW
N−Channel
D
Features
• Avalanche Energy Specified
• Source−to−Drain Diode Recovery Time Comparable to a
Discrete Fast Recovery Diode
• Diode is Characterized for Use in Bridge Circuits
G
• I
and V
Specified at Elevated Temperature
DSS
DS(on)
S
• Pb−Free Package is Available*
MARKING
DIAGRAMS
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
Rating
Symbol Value
Unit
Vdc
Vdc
Drain−to−Source Voltage
V
200
200
4 Drain
DSS
DGR
Drain−to−Gate Voltage (R = 1.0 MW)
V
GS
4
DPAK
CASE 369C
STYLE 2
Gate−to−Source Voltage
− Continuous
V
20
40
Vdc
Vpk
GS
2
1
V
GSM
− Non−repetitive (t ≤ 10 ms)
p
3
Drain Current
− Continuous
− Continuous @ 100°C
− Single Pulse (t ≤ 10 ms)
2
1
Gate
3
I
I
6.0
3.8
18
Adc
Apk
D
D
Drain
Source
I
DM
p
Total Power Dissipation
Derate above 25°C
Total Power Dissipation @ T = 25°C (Note 2)
P
50
0.4
1.75
W
W/°C
W
4
D
4 Drain
A
DPAK
CASE 369D
STYLE 2
Operating and Storage Temperature Range
T , T
J
−55 to
150
°C
stg
1
2
Single Pulse Drain−to−Source Avalanche
E
54
mJ
AS
3
Energy − Starting T = 25°C
J
(V = 80 Vdc, V = 10 Vdc,
DD
GS
I = 6.0 Apk, L = 3.0 mH, R = 25 W)
L
G
1
2
3
Gate Drain Source
6N20E Device Code
Thermal Resistance − Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R
R
R
2.50
100
71.4
°C/W
°C
q
JC
JA
JA
Y
= Year
q
q
WW
G
= Work Week
= Pb−Free Package
Maximum Temperature for Soldering
T
260
L
Purposes, 1/8″ from case for 10 secs
ORDERING INFORMATION
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using the minimum recommended
pad size.
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
2. When surface mounted to an FR4 board using the 0.5 sq. in. drain pad size.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
August, 2005 − Rev. 3
MTD6N20E/D