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MMBTA92-TP-HF PDF预览

MMBTA92-TP-HF

更新时间: 2024-11-20 21:21:27
品牌 Logo 应用领域
美微科 - MCC 光电二极管晶体管
页数 文件大小 规格书
3页 255K
描述
Small Signal Bipolar Transistor, 0.3A I(C), 300V V(BR)CEO, 1-Element, PNP, Silicon, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-3

MMBTA92-TP-HF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.63
最大集电极电流 (IC):0.3 A集电极-发射极最大电压:300 V
配置:SINGLE最小直流电流增益 (hFE):60
JESD-30 代码:R-PDSO-G3元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:PNP
最大功率耗散 (Abs):0.3 W子类别:Other Transistors
表面贴装:YES端子形式:GULL WING
端子位置:DUAL晶体管元件材料:SILICON
标称过渡频率 (fT):50 MHzBase Number Matches:1

MMBTA92-TP-HF 数据手册

 浏览型号MMBTA92-TP-HF的Datasheet PDF文件第2页浏览型号MMBTA92-TP-HF的Datasheet PDF文件第3页 
M C C  
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TM  
Micro Commercial Components  
MMBTA92  
Features  
·
Surface Mount SOT-23 Package  
PNP Silicon High  
Voltage Transistor  
Capable of 300mWatts of Power Dissipation  
Lead Free Finish/RoHS Compliant ("P" Suffix designates  
RoHS Compliant. See ordering information)  
Epoxy meets UL 94 V-0 flammability rating  
Moisure Sensitivity Level 1  
·
·
·
·
Marking: 2D  
Halogen free available upon request by adding suffix "-HF"  
SOT-23  
Electrical Characteristics @ 25OC Unless Otherwise Specified  
A
Symbol  
Parameter  
Min  
Max  
Units  
D
OFF CHARACTERISTICS  
C
V(BR)CEO  
V(BR)CBO  
V(BR)EBO  
Collector-Emitter Breakdown Voltage*  
(IC=-1.0mAdc, IB=0)  
Collector-Base Breakdown Voltage  
(IC=-100µAdc, IE=0)  
Emitter-Base Breakdown Voltage  
(IE=-100µAdc, IC=0)  
-300  
-300  
-5  
Vdc  
Vdc  
Vdc  
B
C
E
B
F
E
IC  
Collector Current-Continuous  
-300  
-500  
mAdc  
mAdc  
nAdc  
ICM  
ICBO  
Collector Current-Pulsed  
Collector Cutoff Current  
(VCB=-200Vdc, IE=0)  
Emitter Cutoff Current  
(VEB=-5Vdc, IC=0)  
-250  
-100  
H
G
IEBO  
nAdc  
K
DIMENSIONS  
ON CHARACTERISTICS  
hFE  
DC Current Gain*  
INCHES  
MIN  
MM  
DIM  
A
B
C
D
E
MAX  
.120  
.104  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
.89  
MAX  
NOTE  
(IC=-1.0mAdc, VCE=-10Vdc)  
(IC=-10mAdc, VCE=-10Vdc)  
(IC=-30mAdc, VCE=-10Vdc)  
Collector-Emitter Saturation Voltage  
(IC=-20mAdc, IB=-2.0mAdc)  
60  
100  
60  
.110  
.083  
.047  
.035  
.070  
.018  
.0005  
.035  
.003  
.015  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
.100  
1.12  
.180  
.51  
200  
VCE(sat)  
VBE(sat)  
-0.2  
-0.9  
Vdc  
Vdc  
F
Base-Emitter Saturation Voltage  
(IC=-20mAdc,IB=-2.0mAdc)  
G
H
J
.085  
.37  
SMALL-SIGNAL CHARACTERISTICS  
K
fT  
Current Gain-Bandwidth Product  
(IC=-10mAdc, VCE=-20Vdc, f=30MHz)  
Collector-Base Capacitance  
(VCB=-20Vdc, IE=0, f=1.0MHz)  
50  
MHz  
pF  
Ccb  
Suggested Solder  
Pad Layout  
6.0  
THERMAL CHARACTERISTICS  
.031  
.800  
Characteristic  
Symbol  
Max  
Unit  
(1)  
Total Device Dissipation FR–5 Board,  
P
225  
mW  
D
.035  
.900  
T
= 25°C  
A
Derate above 25°C  
1.8  
556  
300  
mW/°C  
°C/W  
mW  
.079  
inches  
2.000  
mm  
Thermal Resistance, Junction to Ambient  
R
qJA  
Total Device Dissipation  
(2)  
P
D
Alumina Substrate,  
T = 25°C  
A
.037  
.950  
Derate above 25°C  
2.4  
mW/°C  
°C/W  
°C  
.037  
.950  
Thermal Resistance, Junction to Ambient  
Junction and Storage Temperature  
R
417  
qJA  
T , T  
J stg  
–55 to +150  
www.mccsemi.com  
1 of 3  
Revision: C  
2014/03/19  

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