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TM
Micro Commercial Components
MMBTA92
Features
•
•
·
Surface Mount SOT-23 Package
PNP Silicon High
Voltage Transistor
Capable of 300mWatts of Power Dissipation
Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
Epoxy meets UL 94 V-0 flammability rating
Moisure Sensitivity Level 1
·
·
·
·
Marking: 2D
Halogen free available upon request by adding suffix "-HF"
SOT-23
Electrical Characteristics @ 25OC Unless Otherwise Specified
A
Symbol
Parameter
Min
Max
Units
D
OFF CHARACTERISTICS
C
V(BR)CEO
V(BR)CBO
V(BR)EBO
Collector-Emitter Breakdown Voltage*
(IC=-1.0mAdc, IB=0)
Collector-Base Breakdown Voltage
(IC=-100µAdc, IE=0)
Emitter-Base Breakdown Voltage
(IE=-100µAdc, IC=0)
-300
-300
-5
Vdc
Vdc
Vdc
B
C
E
B
F
E
IC
Collector Current-Continuous
-300
-500
mAdc
mAdc
nAdc
ICM
ICBO
Collector Current-Pulsed
Collector Cutoff Current
(VCB=-200Vdc, IE=0)
Emitter Cutoff Current
(VEB=-5Vdc, IC=0)
-250
-100
H
G
IEBO
nAdc
K
DIMENSIONS
ON CHARACTERISTICS
hFE
DC Current Gain*
INCHES
MIN
MM
DIM
A
B
C
D
E
MAX
.120
.104
.055
.041
.081
.024
.0039
.044
.007
.020
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
MAX
NOTE
(IC=-1.0mAdc, VCE=-10Vdc)
(IC=-10mAdc, VCE=-10Vdc)
(IC=-30mAdc, VCE=-10Vdc)
Collector-Emitter Saturation Voltage
(IC=-20mAdc, IB=-2.0mAdc)
60
100
60
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
200
VCE(sat)
VBE(sat)
-0.2
-0.9
Vdc
Vdc
F
Base-Emitter Saturation Voltage
(IC=-20mAdc,IB=-2.0mAdc)
G
H
J
.085
.37
SMALL-SIGNAL CHARACTERISTICS
K
fT
Current Gain-Bandwidth Product
(IC=-10mAdc, VCE=-20Vdc, f=30MHz)
Collector-Base Capacitance
(VCB=-20Vdc, IE=0, f=1.0MHz)
50
MHz
pF
Ccb
Suggested Solder
Pad Layout
6.0
THERMAL CHARACTERISTICS
.031
.800
Characteristic
Symbol
Max
Unit
(1)
Total Device Dissipation FR–5 Board,
P
225
mW
D
.035
.900
T
= 25°C
A
Derate above 25°C
1.8
556
300
mW/°C
°C/W
mW
.079
inches
2.000
mm
Thermal Resistance, Junction to Ambient
R
qJA
Total Device Dissipation
(2)
P
D
Alumina Substrate,
T = 25°C
A
.037
.950
Derate above 25°C
2.4
mW/°C
°C/W
°C
.037
.950
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature
R
417
qJA
T , T
J stg
–55 to +150
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Revision: C
2014/03/19