生命周期: | Obsolete | 零件包装代码: | TSOP1 |
包装说明: | TSOP1, | 针数: | 48 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.84 |
最长访问时间: | 100 ns | 其他特性: | USER SELECTABLE 3.3V VCC |
备用内存宽度: | 8 | JESD-30 代码: | R-PDSO-G48 |
长度: | 16.4 mm | 内存密度: | 33554432 bit |
内存集成电路类型: | MASK ROM | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 48 |
字数: | 2097152 words | 字数代码: | 2000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 2MX16 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSOP1 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
并行/串行: | PARALLEL | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.3 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | DUAL |
宽度: | 12 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
KM23V4000B-15 | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | |
KM23V4000BG-15 | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 | |
KM23V4000DETG | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 95ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32 | |
KM23V4000DETY | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | |
KM23V4000DETY-12 | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | |
KM23V4000DTG | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 95ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32 | |
KM23V4000DTY | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | |
KM23V4001B-15 | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | |
KM23V4001BG-15 | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 | |
KM23V4100B-25 | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 250ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 |