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K7P321874C-HC250 PDF预览

K7P321874C-HC250

更新时间: 2024-11-14 19:12:47
品牌 Logo 应用领域
三星 - SAMSUNG 时钟静态存储器内存集成电路
页数 文件大小 规格书
15页 450K
描述
Late-Write SRAM, 2MX18, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119

K7P321874C-HC250 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA119,7X17,50
针数:119Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.92最长访问时间:2 ns
其他特性:PIPELINED ARCHITECTURE, IT CAN ALSO OPERATE AT 2.5V SUPPLY最大时钟频率 (fCLK):250 MHz
I/O 类型:COMMONJESD-30 代码:R-PBGA-B119
JESD-609代码:e0长度:22 mm
内存密度:37748736 bit内存集成电路类型:LATE-WRITE SRAM
内存宽度:18功能数量:1
端子数量:119字数:2097152 words
字数代码:2000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:2MX18输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA119,7X17,50封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):225电源:1.8,2.5 V
认证状态:Not Qualified座面最大高度:2.21 mm
最大待机电流:0.07 A最小待机电流:1.7 V
子类别:SRAMs最大压摆率:0.5 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:TIN LEAD端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:14 mm
Base Number Matches:1

K7P321874C-HC250 数据手册

 浏览型号K7P321874C-HC250的Datasheet PDF文件第2页浏览型号K7P321874C-HC250的Datasheet PDF文件第3页浏览型号K7P321874C-HC250的Datasheet PDF文件第4页浏览型号K7P321874C-HC250的Datasheet PDF文件第5页浏览型号K7P321874C-HC250的Datasheet PDF文件第6页浏览型号K7P321874C-HC250的Datasheet PDF文件第7页 
K7P323674C  
K7P321874C  
1Mx36 & 2Mx18 SRAM  
36Mb Late Write SRAM Specification  
119BGA with Pb & Pb-Free  
(RoHS compliant)  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.  
ALL INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or simi-  
lar applications where Product failure could result in loss of life or personal or physical harm, or any military  
or defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
Rev. 1.2 February 2007  
- 1 -  

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