5秒后页面跳转
K7P321874C-GC250 PDF预览

K7P321874C-GC250

更新时间: 2024-11-14 19:12:47
品牌 Logo 应用领域
三星 - SAMSUNG 时钟静态存储器内存集成电路
页数 文件大小 规格书
15页 450K
描述
Late-Write SRAM, 2MX18, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-119

K7P321874C-GC250 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA119,7X17,50
针数:119Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.84最长访问时间:2 ns
其他特性:PIPELINED ARCHITECTURE, IT CAN ALSO OPERATE AT 2.5V SUPPLY最大时钟频率 (fCLK):250 MHz
I/O 类型:COMMONJESD-30 代码:R-PBGA-B119
JESD-609代码:e1长度:22 mm
内存密度:37748736 bit内存集成电路类型:LATE-WRITE SRAM
内存宽度:18湿度敏感等级:2
功能数量:1端子数量:119
字数:2097152 words字数代码:2000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:2MX18
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA119,7X17,50
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:1.8,2.5 V认证状态:Not Qualified
座面最大高度:2.21 mm最大待机电流:0.07 A
最小待机电流:1.7 V子类别:SRAMs
最大压摆率:0.5 mA最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:14 mmBase Number Matches:1

K7P321874C-GC250 数据手册

 浏览型号K7P321874C-GC250的Datasheet PDF文件第2页浏览型号K7P321874C-GC250的Datasheet PDF文件第3页浏览型号K7P321874C-GC250的Datasheet PDF文件第4页浏览型号K7P321874C-GC250的Datasheet PDF文件第5页浏览型号K7P321874C-GC250的Datasheet PDF文件第6页浏览型号K7P321874C-GC250的Datasheet PDF文件第7页 
K7P323674C  
K7P321874C  
1Mx36 & 2Mx18 SRAM  
36Mb Late Write SRAM Specification  
119BGA with Pb & Pb-Free  
(RoHS compliant)  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.  
ALL INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or simi-  
lar applications where Product failure could result in loss of life or personal or physical harm, or any military  
or defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
Rev. 1.2 February 2007  
- 1 -  

与K7P321874C-GC250相关器件

型号 品牌 获取价格 描述 数据表
K7P321874C-GC300 SAMSUNG

获取价格

Late-Write SRAM, 2MX18, 1.6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, B
K7P321874C-HC250 SAMSUNG

获取价格

Late-Write SRAM, 2MX18, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119
K7P321874C-HC300 SAMSUNG

获取价格

Late-Write SRAM, 2MX18, 1.6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119
K7P321888M-GC25 SAMSUNG

获取价格

SRAM
K7P321888M-GC250 SAMSUNG

获取价格

Late-Write SRAM, 2MX18, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA
K7P321888M-GC30 SAMSUNG

获取价格

SRAM
K7P321888M-GC300 SAMSUNG

获取价格

Late-Write SRAM, 2MX18, 1.7ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, B
K7P321888M-HC25 SAMSUNG

获取价格

SRAM
K7P321888M-HC250 SAMSUNG

获取价格

Late-Write SRAM, 2MX18, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119
K7P321888M-HC30 SAMSUNG

获取价格

SRAM