是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 包装说明: | TSSOP, TSSOP66,.46 |
Reach Compliance Code: | compliant | 风险等级: | 5.92 |
Is Samacsys: | N | 最大时钟频率 (fCLK): | 166 MHz |
I/O 类型: | COMMON | 交错的突发长度: | 2,4,8 |
JESD-30 代码: | R-PDSO-G66 | JESD-609代码: | e0 |
内存密度: | 268435456 bit | 内存集成电路类型: | DDR DRAM |
内存宽度: | 16 | 端子数量: | 66 |
字数: | 16777216 words | 字数代码: | 16000000 |
最高工作温度: | 65 °C | 最低工作温度: | |
组织: | 16MX16 | 输出特性: | 3-STATE |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP66,.46 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 2.5 V | 认证状态: | Not Qualified |
刷新周期: | 8192 | 连续突发长度: | 2,4,8 |
子类别: | DRAMs | 最大压摆率: | 0.35 mA |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | GULL WING |
端子节距: | 0.635 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K4D551638F-TC600 | SAMSUNG |
获取价格 |
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | |
K4D551638F-TC60T | SAMSUNG |
获取价格 |
DDR DRAM, 16MX16, CMOS, PDSO66, | |
K4D551638H-LC40 | SAMSUNG |
获取价格 |
DDR DRAM, 16MX16, 0.6ns, CMOS, PDSO66, ROHS COMPLIANT, TSOP2-66 | |
K4D551638H-LC400 | SAMSUNG |
获取价格 |
DDR DRAM, 16MX16, 0.6ns, CMOS, PDSO66, ROHS COMPLIANT, TSOP2-66 | |
K4D551638H-LC50 | SAMSUNG |
获取价格 |
DDR DRAM, 16MX16, 0.65ns, CMOS, PDSO66, ROHS COMPLIANT, TSOP2-66 | |
K4D551638H-LC500 | SAMSUNG |
获取价格 |
DDR DRAM, 16MX16, 0.65ns, CMOS, PDSO66, ROHS COMPLIANT, TSOP2-66 | |
K4D553235F-GC | SAMSUNG |
获取价格 |
256M GDDR SDRAM | |
K4D553235F-GC20 | SAMSUNG |
获取价格 |
Synchronous Graphics RAM, 8MX32, 0.35ns, CMOS, PBGA144, FBGA-144 | |
K4D553235F-GC22 | SAMSUNG |
获取价格 |
Synchronous Graphics RAM, 8MX32, 0.45ns, CMOS, PBGA144, FBGA-144 | |
K4D553235F-GC220 | SAMSUNG |
获取价格 |
DDR DRAM, 8MX32, 0.45ns, CMOS, PBGA144, FBGA-144 |