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IXA37IF1200HJ PDF预览

IXA37IF1200HJ

更新时间: 2024-11-18 12:09:19
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IXYS 晶体晶体管功率控制双极性晶体管局域网
页数 文件大小 规格书
6页 150K
描述
Uninterruptible power supply

IXA37IF1200HJ 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Transferred零件包装代码:TO-247AD
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:4.43Is Samacsys:N
外壳连接:ISOLATED最大集电极电流 (IC):58 A
集电极-发射极最大电压:1200 V配置:SINGLE WITH BUILT-IN DIODE
门极发射器阈值电压最大值:6.5 V门极-发射极最大电压:20 V
JEDEC-95代码:TO-247ADJESD-30 代码:R-PSFM-T3
JESD-609代码:e1元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):195 W
认证状态:Not Qualified子类别:Insulated Gate BIP Transistors
表面贴装:NO端子面层:TIN SILVER COPPER
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):350 ns
标称接通时间 (ton):110 nsBase Number Matches:1

IXA37IF1200HJ 数据手册

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IXA37IF1200HJ  
IC25  
VCES  
VCE(sat)typ  
=
=
=
58 A  
XPT IGBT  
V
V
1200  
1.8  
Copack  
C (2)  
Part number  
IXA37IF1200HJ  
(G) 1  
E (3)  
Features / Advantages:  
Applications:  
Package:  
Housing: ISOPLUS247  
Easy paralleling due to the positive temperature  
coefficient of the on-state voltage  
Rugged XPT design (Xtreme light Punch Through)  
results in:  
- short circuit rated for 10 µsec.  
- very low gate charge  
AC motor drives  
Solar inverter  
Medical equipment  
Uninterruptible power supply  
Air-conditioning systems  
Welding equipment  
Switched-mode and resonant-mode  
power supplies  
rIndustry standard outline  
rDCB isolated backside  
rIsolation Voltage 3000 V  
rEpoxy meets UL 94V-0  
rRoHS compliant  
- low EMI  
- square RBSOA @ 3x Ic  
Thin wafer technology combined with the XPT design  
results in a competitive low VCE(sat)  
SONIC™ diode  
Inductive heating, cookers  
- fast and soft reverse recovery  
- low operating forward voltage  
IGBT  
R a t i n g s  
Conditions  
Symbol  
VCES  
VGES  
IC25  
Definition  
min. typ. max. Unit  
VGE = 0 V  
TVJ = 25°C  
TVJ = 25°C  
TC = 25°C  
TC = 90°C  
TVJ = 25°C  
TVJ = 25°C  
TVJ = 125°C  
1200  
±20  
58  
V
V
Collector emitter voltage  
Maximum DC gate voltage  
Collector current  
A
IC90  
37  
A
Ptot  
195  
W
Total power dissipation  
ICES  
VCE = VCES ; V = 0 V  
0.1 mA  
mA  
Collector emitter leakage current  
GE  
0.1  
IGES  
VCE = 0 V; VGE = ±20 V  
500  
2.1  
nA  
V
Gate emitter leakage current  
VCE(sat)  
35  
15  
1.8  
2.1  
6
IC =  
A; VGE =  
V
TVJ = 25°C  
TVJ = 125°C  
Collector emitter saturation voltage  
V
VGE(th)  
QGon  
td(on)  
t r  
5.4  
6.5  
V
IC = 1.5 mA; VGE = VCE  
Gate emitter threshold voltage  
Total gate charge  
VCE = 600 V; VGE = 15 V; IC = 35 A  
106  
70  
nC  
ns  
ns  
ns  
ns  
mJ  
mJ  
A
Turn-on delay time  
Current rise time  
40  
Turn-off delay time  
Current fall time  
td(off)  
t f  
Inductive load  
250  
100  
3.8  
4.1  
VCE = 600 V; IC = 35 A  
Turn-on energy per pulse  
Turn-off energy per pulse  
TVJ = 125°C  
TVJ = 125°C  
Eon  
VGE = ±15 V; R = 27  
Ω
G
Eoff  
RBSOA  
105  
VGE  
=
15 V;  
RG = 27  
Ω
Reverse bias safe operation area  
VCEK = 1200 V  
Short circuit safe operation area  
Short circuit duration  
SCSOA  
tSC  
VCE = 900 V; VGE= ±15 V  
TVJ = 125°C  
10  
µs  
A
ISC  
RG = 27 ; non-repetitive  
140  
Short circuit current  
Ω
Thermal resistance juntion to case  
RthJC  
0.64 K/W  
IXYS reserves the right to change limits, conditions and dimensions.  
20100623c  
Data according to IEC 60747and per diode unless otherwise specified  
© 2010 IXYS all rights reserved  

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