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IXA40PG1200DHGLB PDF预览

IXA40PG1200DHGLB

更新时间: 2024-11-06 14:56:11
品牌 Logo 应用领域
力特 - LITTELFUSE 光电二极管
页数 文件大小 规格书
3页 160K
描述
我们的表面安装式功率器件(SMPD)封装技术在ISOPLUS?封装组合基础上有所扩展,纳入了可按标准表面安装式(SMD)焊接工艺组装的模块,并可随时取放,在客户现有的SMD组装线上组装。 我们的

IXA40PG1200DHGLB 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G9Reach Compliance Code:compliant
风险等级:5.37其他特性:HIGH RELIABILITY, UL RECOGNIZED
外壳连接:ISOLATED最大集电极电流 (IC):63 A
集电极-发射极最大电压:1200 V配置:SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
门极-发射极最大电压:20 VJESD-30 代码:R-PDSO-G9
元件数量:2端子数量:9
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):230 W
子类别:Insulated Gate BIP Transistors表面贴装:YES
端子面层:Nickel (39) Tin (984)端子形式:GULL WING
端子位置:DUAL晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):350 ns
标称接通时间 (ton):110 nsVCEsat-Max:2.15 V

IXA40PG1200DHGLB 数据手册

 浏览型号IXA40PG1200DHGLB的Datasheet PDF文件第2页浏览型号IXA40PG1200DHGLB的Datasheet PDF文件第3页 
Advanced Technical Information  
IXA 40PG1200DHGLB  
IC25  
VCES  
VCE(sat) typ = 1.85V  
= 63A  
=1200V  
XPT IGBT phaseleg  
ISOPLUS™  
Surface Mount Power Device  
7
D3  
D4  
6
1
D1  
D2  
S1  
4
5
9
S2  
3
2
E72873  
8
Features  
IGBTs S1, S2  
• XPT IGBT  
- low saturation voltage  
- positive temperature coefficient for  
easy paralleling  
- fast switching  
- short tail current for optimized  
performance in resonant circuits  
• SonicTM diode  
- fast reverse recovery  
- low operating forward voltage  
- low leakage current  
• VCEsat detection diode  
- integrated into package  
- very fast diode  
Symbol  
VCES  
Conditions  
Maximum Ratings  
TVJ = 25°C to 150°C  
1200  
20  
V
VGES  
V
IC25  
IC80  
TC = 25°C  
TC = 80°C  
63  
45  
A
A
ICM  
VCEK  
VGE = 15 V; RG = 27 W; TVJ = 125°C  
RBSOA, clamped inductive load; L = 100 µH  
105  
VCES  
A
µs  
W
tSC  
VCE = 900 V; VGE = 15 V; RG = 27 W; TVJ = 125°C  
10  
(SCSOA) none repetitive  
Ptot  
TVJ = 25°C  
230  
• Package  
Symbol  
Conditions  
Characteristic  
Values  
- isolated back surface  
- low coupling capacity between pins  
and heatsink  
(TVJ = 25°C, unless otherwise specified)  
- PCB space saving  
min. typ. max.  
- enlarged creepage towards heatsink  
- application friendly pinout  
- low inductive current path  
- high reliability  
VCE(sat)  
IC = 35 A; VGE = 15 V; TVJ = 25°C  
VJ = 125°C  
1.85  
2.2  
2.15  
V
V
T
VGE(th)  
ICES  
IC = 1.5 mA; VGE = VCE  
VCE = VCES; VGE = 0 V; TVJ = 25°C  
VJ = 125°C  
5.4  
6.5  
V
0.15  
mA  
mA  
Applications  
T
0.25  
• Phaseleg  
- buck-boost chopper  
IGES  
VCE = 0 V; VGE  
=
20 V  
200  
nA  
td(on)  
tr  
td(off)  
tf  
Eon  
Eoff  
70  
40  
250  
100  
3.8  
4.1  
ns  
ns  
ns  
ns  
mJ  
mJ  
• Full bridge  
- power supplies  
- induction heating  
- four quadrant DC drives  
- controlled rectifier  
• Three phase bridge  
- AC drives  
Inductive load; TVJ = 125°C  
VCE = 600 V; IC = 35 A  
VGE = 15 V; RG = 27 W  
Cies  
QGon  
VCE = 25 V; VGE = 0 V; f = 1 MHz  
VCE = 600 V; VGE = 15 V; IC = 35 A  
tbd  
107  
pF  
nC  
- controlled rectifier  
RthJC  
RthJH  
0.55 K/W  
0.95 K/W  
with heatsink compound (IXYS test setup)  
0.75  
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2012 IXYS All rights reserved  
20120131b  
1 - 3  

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