IRLZ34S, IRLZ34L, SiHLZ34S, SiHLZ34L
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Halogen-free According to IEC 61249-2-21
Definition
60
• Advanced Process Technology
RDS(on) ()
VGS = 5 V
0.05
• Surface Mount (IRLZ34S, SiHLZ34S)
• Low-Profile Through-Hole (IRLZ34L, SiHLZ34L)
• 175 °C Operating Temperature
• Fast Switching
Qg (Max.) (nC)
35
7.1
Q
Q
gs (nC)
gd (nC)
25
• Fully Avalanche Rated
• Compliant to RoHS Directive 2002/95/EC
Configuration
Single
D
DESCRIPTION
D2PAK (TO-263)
Third generation Power MOSFETs from Vishay utilize
advanced processing techniques to achieve extremely low
on-resistance per silicon area. This benefit, combined with
the fast swichting speed and ruggedized device design that
Power MOSFETs are known for, provides the designer with
an extremely efficient and reliable device for use in a wide
variety of applications.
I2PAK (TO-262)
G
G
D
S
D
S
G
The D2PAK is a surface mount power package capable of
S
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D2PAK is suitable for high current applications because of
its low internal connection resistance and can dissipate up
to 2.0 W in a typical surface mount application.
N-Channel MOSFET
The through-hole version (IRLZ34L, SiHLZ34L) is available
for low-profile applications.
ORDERING INFORMATION
Package
D2PAK (TO-263)
I2PAK (TO-262)
-
Lead (Pb) free and Halogen-free
SiHLZ34S-GE3
-
-
IRLZ34LPbF
SiHLZ34L-E3
Lead (Pb) free
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
60
V
VGS
10
TC = 25 °C
C = 100 °C
30
21
Continuous Drain Current
VGS at 5 V
ID
T
A
Pulsed Drain Currenta
IDM
110
Linear Derating Factor
Single Pulse Avalanche Energyb
0.59
W/°C
mJ
EAS
PD
128
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
T
C = 25 °C
88
W
V/ns
°C
TA = 25 °C
3.7
dV/dt
4.5
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TJ, Tstg
- 55 to + 175
300d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, Starting TJ = 25 °C, L = 285 μH, Rg = 25 , IAS = 30 A (see fig. 12).
c. ISD 30 A, dI/dt 200 A/μs, VDD VDS, TJ 175 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 90418
S11-1044-Rev. D, 30-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000