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IRLZ34NS PDF预览

IRLZ34NS

更新时间: 2024-10-31 22:51:39
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 275K
描述
HEXFET Power MOSFET

IRLZ34NS 技术参数

是否Rohs认证:不符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.05Is Samacsys:N
其他特性:LOGIC LEVEL COMPATIBLE, HIGH RELIABILITY雪崩能效等级(Eas):110 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:55 V最大漏极电流 (ID):30 A
最大漏源导通电阻:0.046 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e0湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):110 A认证状态:Not Qualified
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRLZ34NS 数据手册

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Previous Datasheet  
Index  
Next Data Sheet  
PD - 9.1308A  
IRLZ34NS  
PRELIMINARY  
HEXFET® Power MOSFET  
l Logic-Level Gate Drive  
l Advanced Process Technology  
l Surface Mount  
D
VDSS = 55V  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
RDS(on) = 0.035Ω  
G
l Fully Avalanche Rated  
ID = 27A  
S
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve the  
lowestpossibleon-resistancepersiliconarea. Thisbenefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
knownfor, providesthedesignerwithanextremelyefficient  
device for use in a wide variety of applications.  
The D2Pak is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible on-  
resistance in any existing surface mount package. The  
D2Pak is suitable for high current applications because of  
its low internal connection resistance and can dissipate up  
to 2.0W in a typical surface mount application.  
D 2 Pak  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10Vꢀ  
Continuous Drain Current, VGS @ 10Vꢀ  
Pulsed Drain Current   
27  
19  
A
110  
PD @TC = 25°C  
Power Dissipation  
56  
W
W/°C  
V
Linear Derating Factor  
0.37  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
±16  
Single Pulse Avalanche Energy ‚ꢀ  
Avalanche Current  
110  
mJ  
A
16  
5.6  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒꢀ  
Operating Junction and  
mJ  
V/ns  
10  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case)  
Thermal Resistance  
Parameter  
Min.  
––––  
––––  
Typ.  
––––  
––––  
Max.  
2.7  
40  
Units  
RθJC  
RθJA  
Junction-to-Case  
°C/W  
Junction-to-Ambient (PCB Mount,steady-state)**  
To Order  
11/11/96  
 
 

IRLZ34NS 替代型号

型号 品牌 替代类型 描述 数据表
IRLZ34NSTRLPBF INFINEON

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IRLZ34NSPBF INFINEON

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HEXFET Power MOSFET ( VDSS = 55V , RDS(on) =

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