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IRHMJ54160

更新时间: 2024-11-20 03:49:19
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 161K
描述
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (TO-254AA Tabless)

IRHMJ54160 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:HERMETIC SEALED, TABLESS TO-254AA, 3 PINReach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.21
Is Samacsys:N雪崩能效等级(Eas):500 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):35 A
最大漏极电流 (ID):35 A最大漏源导通电阻:0.018 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-XSSO-G3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):250 W最大脉冲漏极电流 (IDM):140 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:TIN LEAD
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRHMJ54160 数据手册

 浏览型号IRHMJ54160的Datasheet PDF文件第2页浏览型号IRHMJ54160的Datasheet PDF文件第3页浏览型号IRHMJ54160的Datasheet PDF文件第4页浏览型号IRHMJ54160的Datasheet PDF文件第5页浏览型号IRHMJ54160的Datasheet PDF文件第6页浏览型号IRHMJ54160的Datasheet PDF文件第7页 
                                                                         
PD-96916  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (TO-254AA Tabless)  
IRHMJ57160  
100V, N-CHANNEL  
TECHNOLOGY  
5
™
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
IRHMJ57160 100K Rads (Si)  
IRHMJ53160 300K Rads (Si)  
IRHMJ54160 600K Rads (Si)  
0.01835A*  
0.01835A*  
0.01835A*  
IRHMJ58160 1000K Rads (Si) 0.01935A*  
TO-254AA Tabless  
International Rectifier’s R5TM technology provides  
high performance power MOSFETs for space  
applications. These devices have been characterized  
for Single Event Effects (SEE) with useful performance  
up to an LET of 80 (MeV/(mg/cm2)). The combination  
Features:  
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Identical Pre- and Post-Electrical Test Conditions  
Repetitive Avalanche Ratings  
Dynamic dv/dt Ratings  
Simple Drive Requirements  
Ease of Paralleling  
of low R  
and low gate charge reduces the  
DS(on)  
power losses in switching applications such as DC  
to DC converters and motor control. These devices  
retain all of the well established advantages of  
MOSFETs such as voltage control, fast switching,  
ease of paralleling and temperature stability of  
electrical parameters.  
Hermatically Sealed  
Electically Isolated  
n
n
Ceramic Eyelets  
Light Weight  
Pre-Irradiation  
Absolute Maximum Ratings  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C  
Continuous Drain Current  
35*  
D
D
GS  
GS  
C
A
I
= 12V, T = 100°C Continuous Drain Current  
35*  
140  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
DM  
@ T = 25°C  
P
250  
W
W/°C  
V
D
C
2.0  
V
±20  
GS  
E
Single Pulse Avalanche Energy Á  
Avalanche Current À  
500  
mJ  
A
AS  
I
35  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
25  
mJ  
V/ns  
AR  
dv/dt  
3.4  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
Pckg. Mounting Surface Temp.  
Weight  
300 (for 5s)  
3.7 (Typical)  
* Current is limited by package  
For footnotes refer to the last page  
www.irf.com  
1
12/24/04  

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