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IRFR3504ZTRR PDF预览

IRFR3504ZTRR

更新时间: 2024-11-05 20:16:27
品牌 Logo 应用领域
英飞凌 - INFINEON 局域网开关脉冲晶体管
页数 文件大小 规格书
12页 265K
描述
Power Field-Effect Transistor, 42A I(D), 40V, 0.009ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, PLASTIC, DPAK-3

IRFR3504ZTRR 数据手册

 浏览型号IRFR3504ZTRR的Datasheet PDF文件第2页浏览型号IRFR3504ZTRR的Datasheet PDF文件第3页浏览型号IRFR3504ZTRR的Datasheet PDF文件第4页浏览型号IRFR3504ZTRR的Datasheet PDF文件第5页浏览型号IRFR3504ZTRR的Datasheet PDF文件第6页浏览型号IRFR3504ZTRR的Datasheet PDF文件第7页 
PD - 94753A  
IRFR3504Z  
AUTOMOTIVE MOSFET  
IRFU3504Z  
HEXFET® Power MOSFET  
Features  
D
l
l
l
l
l
Advanced Process Technology  
VDSS = 40V  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
RDS(on) = 9.0mΩ  
G
Repetitive Avalanche Allowed up to Tjmax  
ID = 42A  
S
Description  
Specifically designed for Automotive applications, this HEXFET®  
Power MOSFET utilizes the latest processing techniques to  
achieve extremely low on-resistance per silicon area. Additional  
features of this design are a 175°C junction operating tempera-  
ture, fast switching speed and improved repetitive avalanche  
rating . These features combine to make this design an extremely  
efficientandreliabledeviceforuseinAutomotiveapplicationsand  
a wide variety of other applications.  
D-Pak  
IRFR3504Z  
I-Pak  
IRFU3504Z  
Absolute Maximum Ratings  
Parameter  
Max.  
77  
Units  
(Silicon Limited)  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
I
@ T = 25°C  
C
D
D
D
@ T = 100°C  
C
54  
A
(Package Limited)  
@ T = 25°C  
C
42  
310  
90  
DM  
P
@T = 25°C  
Power Dissipation  
C
W
D
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
0.60  
± 20  
W/°C  
V
V
GS  
EAS (Thermally limited)  
77  
mJ  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (Tested )  
110  
IAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
EAR  
mJ  
T
J
Operating Junction and  
-55 to + 175  
T
Storage Temperature Range  
°C  
STG  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
300 (1.6mm from case )  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.66  
40  
Units  
Rθ  
Rθ  
Rθ  
Junction-to-Case  
Junction-to-Ambient (PCB mount)  
JC  
JA  
JA  
°C/W  
Junction-to-Ambient  
110  
HEXFET® is a registered trademark of International Rectifier.  
www.irf.com  
1
06/05/04  

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