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IRFR3607TRLPBF PDF预览

IRFR3607TRLPBF

更新时间: 2024-11-24 13:00:11
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 369K
描述
Power Field-Effect Transistor, 80A I(D), 75V, 0.009ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, LEAD FREE, PLASTIC, DPAK-3

IRFR3607TRLPBF 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:LEAD FREE, PLASTIC, DPAK-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.1
Is Samacsys:N雪崩能效等级(Eas):120 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:75 V最大漏极电流 (Abs) (ID):80 A
最大漏极电流 (ID):56 A最大漏源导通电阻:0.009 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-252AA
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):140 W最大脉冲漏极电流 (IDM):310 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFR3607TRLPBF 数据手册

 浏览型号IRFR3607TRLPBF的Datasheet PDF文件第2页浏览型号IRFR3607TRLPBF的Datasheet PDF文件第3页浏览型号IRFR3607TRLPBF的Datasheet PDF文件第4页浏览型号IRFR3607TRLPBF的Datasheet PDF文件第5页浏览型号IRFR3607TRLPBF的Datasheet PDF文件第6页浏览型号IRFR3607TRLPBF的Datasheet PDF文件第7页 
PD - 97312  
IRFR3607PbF  
IRFU3607PbF  
Applications  
l High Efficiency Synchronous Rectification in  
HEXFET® Power MOSFET  
SMPS  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
D
S
VDSS  
RDS(on) typ.  
max.  
ID (Silicon Limited)  
ID (Package Limited)  
75V  
7.34m  
9.0m  
G
80A  
c
Benefits  
l Improved Gate, Avalanche and Dynamic  
56A  
dv/dt Ruggedness  
l Fully Characterized Capacitance and  
Avalanche SOA  
D
l Enhanced body diode dV/dt and dI/dt  
Capability  
S
S
D
G
G
D-Pak  
IRFR3607PbF  
I-Pak  
IRFU3607PbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
80c  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited)  
56c  
A
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)  
Pulsed Drain Current d  
56  
310  
PD @TC = 25°C  
140  
W
Maximum Power Dissipation  
Linear Derating Factor  
0.96  
W/°C  
V
VGS  
20  
Gate-to-Source Voltage  
27  
Peak Diode Recovery f  
dv/dt  
TJ  
V/ns  
°C  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
300  
Avalanche Characteristics  
Single Pulse Avalanche Energy e  
EAS (Thermally limited)  
120  
46  
mJ  
A
Avalanche Currentꢀd  
IAR  
Repetitive Avalanche Energy g  
EAR  
14  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Junction-to-Case k  
Junction-to-Ambient j  
Junction-to-Ambient (PCB Mount)  
Typ.  
–––  
–––  
–––  
Max.  
1.045  
50  
Units  
°C/W  
RθJC  
RθJA  
RθJA  
110  
jk  
www.irf.com  
1
03/04/08  

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