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IRFR3704Z PDF预览

IRFR3704Z

更新时间: 2024-11-20 12:33:43
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体转换器晶体管开关脉冲计算机
页数 文件大小 规格书
11页 4211K
描述
High Frequency Synchronous Buck Converters for Computer Processor Power

IRFR3704Z 数据手册

 浏览型号IRFR3704Z的Datasheet PDF文件第2页浏览型号IRFR3704Z的Datasheet PDF文件第3页浏览型号IRFR3704Z的Datasheet PDF文件第4页浏览型号IRFR3704Z的Datasheet PDF文件第5页浏览型号IRFR3704Z的Datasheet PDF文件第6页浏览型号IRFR3704Z的Datasheet PDF文件第7页 
PD - 94725  
IRFR3704Z  
IRFU3704Z  
HEXFET® Power MOSFET  
Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power  
l High Frequency Isolated DC-DC  
Converters with Synchronous Rectification  
for Telecom and Industrial Use  
VDSS RDS(on) max  
Qg  
9.3nC  
8.4m:  
20V  
Benefits  
l Very Low RDS(on) at 4.5V VGS  
l Ultra-Low Gate Impedance  
l Fully Characterized Avalanche Voltage  
and Current  
D-Pak  
I-Pak  
IRFR3704Z  
IRFU3704Z  
Absolute Maximum Ratings  
Parameter  
Max.  
20  
Units  
V
VDS  
Drain-to-Source Voltage  
V
± 20  
60  
Gate-to-Source Voltage  
GS  
I
I
I
@ TC = 25°C  
A
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
D
D
@ TC = 100°C  
42  
240  
48  
DM  
P
P
@TC = 25°C  
W
Maximum Power Dissipation  
Maximum Power Dissipation  
Linear Derating Factor  
D
D
@TC = 100°C  
24  
0.32  
W/°C  
°C  
T
-55 to + 175  
Operating Junction and  
J
T
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
STG  
300 (1.6mm from case)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
3.1  
Units  
°C/W  
RθJC  
Junction-to-Case  
RθJA  
RθJA  
50  
Junction-to-Ambient (PCB Mount)  
Junction-to-Ambient  
110  
www.kersemi.com  
1
07/10/03  

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