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IRFHE4250DPBF PDF预览

IRFHE4250DPBF

更新时间: 2024-11-25 01:16:59
品牌 Logo 应用领域
英飞凌 - INFINEON PC
页数 文件大小 规格书
12页 382K
描述
Low thermal resistance path to the PCB

IRFHE4250DPBF 数据手册

 浏览型号IRFHE4250DPBF的Datasheet PDF文件第2页浏览型号IRFHE4250DPBF的Datasheet PDF文件第3页浏览型号IRFHE4250DPBF的Datasheet PDF文件第4页浏览型号IRFHE4250DPBF的Datasheet PDF文件第5页浏览型号IRFHE4250DPBF的Datasheet PDF文件第6页浏览型号IRFHE4250DPBF的Datasheet PDF文件第7页 
FASTIRFET™  
IRFHE4250DPbF  
HEXFET® Power MOSFET  
Q1  
25  
Q2  
25  
VDSS  
V
RDS(on) max  
(@VGS = 4.5V)  
4.10  
13  
1.35  
35  
m  
nC  
Qg (typical)  
ID  
60  
60  
A
(@TC = 25°C)  
Applications  
Control and Synchronous MOSFETs for synchronous buck  
converters  
DUAL PQFN 6X6 mm  
Benefits  
Features  
Control and synchronous MOSFETs in one package  
Low thermal resistance path to the PCB  
Low thermal resistance path to the top  
Low charge control MOSFET (13nC typical)  
Low RDSON synchronous MOSFET (<1.35m)  
Intrinsic schottky diode with low forward voltage on Q2  
RoHS compliant, halogen-free  
Increased power density  
Increased power density  
Increased power density  
Lower switching losses  
Lower conduction losses  
Lower switching losses  
Environmentally friendlier  
Increased reliability  
results in  
MSL2, industrial qualification  
Base part number  
Package Type  
Standard Pack  
Orderable Part Number  
IRFHE4250DTRPbF  
Form  
Quantity  
4000  
IRFHE4250DPbF  
Dual PQFN 6mm x 6mm  
Tape and Reel  
Absolute Maximum Ratings  
Parameter  
Gate-to-Source Voltage  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Q1 Max.  
Q2 Max.  
Units  
VGS  
± 16  
V
A
ID @ TC = 25°C  
86  
69  
303  
243  
ID @ TC = 70°C  
ID @ TC = 25°C  
Continuous Drain Current  
(Source Bonding Technology Limited)  
60  
60  
IDM  
Pulsed Drain Current  
Power Dissipation  
Power Dissipation  
180  
156  
100  
525  
156  
PD @TC = 25°C  
PD @TC = 70°C  
W
100  
Linear Derating Factor  
1.3  
1.3  
W/°C  
°C  
TJ  
Operating Junction and  
Storage Temperature Range  
-55 to + 150  
TSTG  
Thermal Resistance  
Parameter  
Q1 Max.  
Q2 Max.  
Units  
Junction-to-Case   
3.7  
0.91  
24  
0.91  
2.1  
24  
RJC (Bottom)  
RJC (Top)  
RJA  
°C/W  
Junction-to-Case   
Junction-to-Ambient   
Junction-to-Ambient   
17  
17  
RJA (<10s)  
Notes through are on page 12  
1
www.irf.com  
© 2013 International Rectifier  
September 26, 2013  

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