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IRFHM4226PBF_15 PDF预览

IRFHM4226PBF_15

更新时间: 2024-11-19 01:16:59
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 560K
描述
Compatible with Existing Surface Mount Techniques

IRFHM4226PBF_15 数据手册

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FastIRFET™  
IRFHM4226TRPbF  
HEXFET® Power MOSFET  
VDSS  
25  
V
RDS(on) max  
(@ VGS = 10V)  
2.4  
m  
(@ VGS = 4.5V)  
3.3  
16  
Qg (typical)  
nC  
A
ID  
60  
(@TC (Bottom) = 25°C)  
PQFN 3.3 x 3.3 mm  
Applications  
Control or Synchronous MOSFET for high frequency buck converters  
Features  
Benefits  
Low RDSon (<2.4m)  
Low Charge (typical 16nC)  
Low Thermal Resistance to PCB (<3.2°C/W)  
Lower Conduction Losses  
Low Switching Losses  
Enable better thermal dissipation  
Increased Power Density  
Multi-Vendor Compatibility  
Easier Manufacturing  
Low Profile (<0.9 mm)  
results in  
Industry-Standard Pinout  
Compatible with Existing Surface Mount Techniques  
RoHS Compliant, Halogen-Free  
MSL1  
  
Environmentally Friendlier  
Increased Reliability  
Standard Pack  
Base part number  
Package Type  
Orderable Part Number  
Form  
Quantity  
IRFHM4226TRPbF  
PQFN 3.3mm x 3.3mm  
Tape and Reel  
4000  
IRFHM4226TRPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
± 20  
Units  
VGS  
Gate-to-Source Voltage  
V
ID @ TA = 25°C  
ID @ TC(Bottom) = 25°C  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
28  
105  
67  
A
ID @ TC(Bottom) = 100°C Continuous Drain Current, VGS @ 10V  
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V  
(Source Bonding Technology Limited)  
Pulsed Drain Current   
60  
IDM  
420  
2.7  
PD @TA = 25°C  
PD @TC(Bottom) = 25°C  
Power Dissipation   
W
Power Dissipation   
39  
Linear Derating Factor   
Operating Junction and  
Storage Temperature Range  
0.021  
W/°C  
TJ  
-55 to + 150  
°C  
TSTG  
Notes through are on page 9  
1
www.irf.com © 2014 International Rectifier  
Submit Datasheet Feedback  
December 9, 2014  

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