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IRFB20N50K PDF预览

IRFB20N50K

更新时间: 2024-11-08 22:24:11
品牌 Logo 应用领域
英飞凌 - INFINEON 开关
页数 文件大小 规格书
8页 116K
描述
SMPS MOSFET

IRFB20N50K 数据手册

 浏览型号IRFB20N50K的Datasheet PDF文件第2页浏览型号IRFB20N50K的Datasheet PDF文件第3页浏览型号IRFB20N50K的Datasheet PDF文件第4页浏览型号IRFB20N50K的Datasheet PDF文件第5页浏览型号IRFB20N50K的Datasheet PDF文件第6页浏览型号IRFB20N50K的Datasheet PDF文件第7页 
PD - 94418  
IRFB20N50K  
SMPS MOSFET  
HEXFET® Power MOSFET  
Applications  
VDSS  
500V  
RDS(on) typ.  
ID  
20A  
l Switch Mode Power Supply (SMPS)  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency  
Circuits  
0.21Ω  
Benefits  
l Low Gate Charge Qg results in Simple Drive Requirement  
l Improved Gate, Avalanche and Dynamicdv/dt Ruggedness  
l Fully Characterized Capacitance and Avalanche Voltage  
and Current  
TO-220AB  
l Low RDS(on)  
Absolute Maximum Ratings  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
Max.  
20  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
12  
80  
A
PD @TC = 25°C  
Power Dissipation  
280  
W
W/°C  
V
Linear Derating Factor  
2.2  
VGS  
dv/dt  
TJ  
Gate-to-Source Voltage  
± 30  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
6.9  
V/ns  
-55 to + 150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case )  
300  
10  
°C  
Mounting Torque, 6-32 or M3 screw  
N
Avalanche Characteristics  
Symbol  
EAS  
Parameter  
Single Pulse Avalanche Energy‚  
Typ.  
Max.  
330  
20  
Units  
mJ  
–––  
–––  
–––  
IAR  
Avalanche Current  
A
EAR  
Repetitive Avalanche Energy  
28  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
0.45  
–––  
58  
Units  
RθJC  
RθCS  
RθJA  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.50  
–––  
°C/W  
www.irf.com  
1
4/2/02  

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