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IRFB3006 PDF预览

IRFB3006

更新时间: 2024-11-07 11:13:43
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 251K
描述
The IR MOSFET™ family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors, inverters, SMPS, lighting, load switches as well as battery powered applications. The devices are available in a variety of surface mount and through-hole packages with industry standard footprints for ease of design. The optimized gate drive options enables designers the flexibility of selecting super, logic or normal level drives.

IRFB3006 数据手册

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IRFB3006PbF  
HEXFET® Power MOSFET  
Applications  
l High Efficiency Synchronous Rectification  
D
S
VDSS  
RDS(on) typ.  
max.  
60V  
2.1m  
2.5m  
in SMPS  
l UninterruptiblePowerSupply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
G
ID  
270A  
(Silicon Limited)  
ID  
195A  
(Package Limited)  
Benefits  
l Improved Gate, Avalanche and Dynamic  
D
dV/dtRuggedness  
l Fully Characterized Capacitance and  
AvalancheSOA  
l Enhanced body diode dV/dt and dI/dt Capability  
l Lead-Free  
S
D
G
l RoHS Compliant, Halogen-Free  
TO-220AB  
G
D
S
Gate  
Drain  
Source  
Standard Pack  
Form  
Tube  
Base Part Number  
Package Type  
Orderable Part Number  
Quantity  
IRFB3006PbF  
TO-220  
50  
IRFB3006PbF  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
270  
190  
195  
1080  
375  
2.5  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)  
Pulsed Drain Current  
A
PD @TC = 25°C  
W
Maximum Power Dissipation  
Linear Derating Factor  
W/°C  
V
VGS  
± 20  
10  
Gate-to-Source Voltage  
Peak Diode Recovery  
dv/dt  
TJ  
V/ns  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
°C  
300  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
10lb in (1.1N m)  
Mounting torque, 6-32 or M3 screw  
Avalanche Characteristics  
Single Pulse Avalanche Energy  
EAS (Thermally limited)  
320  
mJ  
A
Avalanche Current  
IAR  
See Fig. 14, 15, 22a, 22b,  
Repetitive Avalanche Energy  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.4  
Units  
RθJC  
RθCS  
RθJA  
Junction-to-Case  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
0.50  
–––  
–––  
62  
°C/W  
1
www.irf.com © 2014 International Rectifier  
Submit Datasheet Feedback  
April 23, 2014  

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