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IRFB20N50KPBF PDF预览

IRFB20N50KPBF

更新时间: 2024-11-27 05:39:27
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 858K
描述
Power MOSFET

IRFB20N50KPBF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Not Recommended零件包装代码:TO-220AB
包装说明:ROHS COMPLIANT PACKAGE-3针数:3
Reach Compliance Code:not_compliantFactory Lead Time:9 weeks
风险等级:6.97雪崩能效等级(Eas):330 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):20 A
最大漏极电流 (ID):20 A最大漏源导通电阻:0.25 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT APPLICABLE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):280 W
最大脉冲漏极电流 (IDM):80 A认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT APPLICABLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFB20N50KPBF 数据手册

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IRFB20N50K, SiHFB20N50K  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Low Gate Charge Qg Results in Simple Drive  
Requirement  
PRODUCT SUMMARY  
VDS (V)  
500  
Available  
RDS(on) (Ω)  
VGS = 10 V  
0.21  
RoHS*  
• Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
Qg (Max.) (nC)  
Qgs (nC)  
110  
33  
COMPLIANT  
• Fully Characterized Capacitance and Avalanche Voltage  
and Current  
Q
gd (nC)  
54  
Configuration  
Single  
• Low RDS(on)  
D
• Lead (Pb)-free Available  
TO-220  
APPLICATIONS  
• Switch Mode Power Supply (SMPS)  
• Uninterruptible Power Supply  
• High Speed Power Switching  
• Hard Switched and High Frequency Circuits  
G
S
D
G
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
TO-220  
IRFB20N50KPbF  
SiHFB20N50K-E3  
IRFB20N50K  
Lead (Pb)-free  
SnPb  
SiHFB20N50K  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
500  
30  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
TC = 25 °C  
TC =100°C  
20  
Continuous Drain Current  
VGS at 10 V  
ID  
12  
A
Pulsed Drain Currenta  
IDM  
80  
Linear Derating Factor  
2.2  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
Maximum Power Dissipation  
EAS  
IAR  
330  
20  
EAR  
28  
280  
mJ  
W
TC = 25 °C  
PD  
Peak Diode Recovery dV/dtc  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
Mounting Torque  
dV/dt  
TJ, Tstg  
6.9  
V/ns  
- 55 to + 150  
300d  
°C  
N
for 10 s  
6-32 or M3 screw  
10  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature.  
b. Starting TJ = 25 °C, L = 1.6 mH, RG = 25 Ω, IAS = 20 A.  
c. ISD 20 A, dI/dt 350 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91101  
S-Pending-Rev. A, 11-Aug-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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