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IRFB3077 PDF预览

IRFB3077

更新时间: 2024-11-28 14:53:19
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 303K
描述
The IR MOSFET? family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors, inverters, SMPS, lighting, load switches as well as battery powered applications. The devices are available in a variety of surface mount and through-hole packages with industry standard footprints for ease of design. The optimized gate drive options enables designers the flexibility of selecting super, logic or normal level drives.

IRFB3077 数据手册

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PD - 97047B  
IRFB3077PbF  
Applications  
HEXFET® Power MOSFET  
l High Efficiency Synchronous Rectification in SMPS  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
D
S
VDSS  
RDS(on) typ.  
max.  
75V  
2.8m  
3.3m  
:
:
Benefits  
G
l Worldwide Best RDS(on) in TO-220  
l Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
l Fully Characterized Capacitance and Avalanche  
SOA  
ID  
210A  
c
(Silicon Limited)  
ID  
120A  
(Package Limited)  
D
l Enhanced body diode dV/dt and dI/dt Capability  
S
D
G
TO-220AB  
IRFB3077PbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Parameter  
Max.  
210c  
150c  
120  
Units  
A
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)  
Pulsed Drain Current d  
850  
PD @TC = 25°C  
370  
Maximum Power Dissipation  
W
2.5  
Linear Derating Factor  
W/°C  
V
VGS  
± 20  
Gate-to-Source Voltage  
2.5  
Peak Diode Recovery f  
dV/dt  
TJ  
V/ns  
°C  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
300  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
10lbxin (1.1Nxm)  
Mounting torque, 6-32 or M3 screw  
Avalanche Characteristics  
Single Pulse Avalanche Energy e  
EAS (Thermally limited)  
200  
mJ  
A
Avalanche Current d  
IAR  
See Fig. 14, 15, 22a, 22b,  
Repetitive Avalanche Energy g  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.402  
–––  
Units  
RθJC  
RθCS  
RθJA  
Junction-to-Case k  
Case-to-Sink, Flat Greased Surface  
0.50  
–––  
°C/W  
Junction-to-Ambient jk  
62  
www.irf.com  
1
5/2/11  

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