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IRFB3077PBF PDF预览

IRFB3077PBF

更新时间: 2024-11-06 11:09:31
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体开关晶体管脉冲局域网
页数 文件大小 规格书
8页 315K
描述
High Efficiency Synchronous Rectification in SMPS

IRFB3077PBF 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:LEAD FREE, PLASTIC PACKAGE-3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:15 weeks
风险等级:1.12Is Samacsys:N
雪崩能效等级(Eas):200 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:75 V
最大漏极电流 (Abs) (ID):210 A最大漏极电流 (ID):120 A
最大漏源导通电阻:0.0033 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):370 W
最大脉冲漏极电流 (IDM):850 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFB3077PBF 数据手册

 浏览型号IRFB3077PBF的Datasheet PDF文件第2页浏览型号IRFB3077PBF的Datasheet PDF文件第3页浏览型号IRFB3077PBF的Datasheet PDF文件第4页浏览型号IRFB3077PBF的Datasheet PDF文件第5页浏览型号IRFB3077PBF的Datasheet PDF文件第6页浏览型号IRFB3077PBF的Datasheet PDF文件第7页 
PD - 97047  
IRFB3077PbF  
Applications  
HEXFET® Power MOSFET  
l High Efficiency Synchronous Rectification in SMPS  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
D
S
VDSS  
RDS(on) typ.  
max.  
75V  
2.8m:  
G
3.3m:  
210A  
Benefits  
l Worldwide Best RDS(on) in TO-220  
l Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
ID  
D
l Fully Characterized Capacitance and Avalanche  
SOA  
l Enhanced body diode dV/dt and dI/dt Capability  
S
D
G
TO-220AB  
IRFB3077PbF  
G
D
S
G a te  
D ra in  
S o u rce  
Absolute Maximum Ratings  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Parameter  
Continuous Drain Current, VGS @ 10V  
Max.  
210c  
150 c  
850  
Units  
A
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current d  
PD @TC = 25°C  
370  
Maximum Power Dissipation  
Linear Derating Factor  
W
2.5  
W/°C  
V
VGS  
± 20  
Gate-to-Source Voltage  
2.5  
Peak Diode Recovery f  
Operating Junction and  
dV/dt  
TJ  
V/ns  
°C  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
300  
10lbxin (1.1Nxm)  
Mounting torque, 6-32 or M3 screw  
Avalanche Characteristics  
Single Pulse Avalanche Energy e  
EAS (Thermally limited)  
240  
mJ  
A
Avalanche Currentꢀc  
IAR  
See Fig. 14, 15, 22a, 22b,  
Repetitive Avalanche Energy g  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.402  
–––  
Units  
RθJC  
RθCS  
RθJA  
Junction-to-Case k  
Case-to-Sink, Flat Greased Surface  
0.50  
–––  
°C/W  
Junction-to-Ambient jk  
62  
www.irf.com  
1
10/24/05  

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