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IRF7822PBF PDF预览

IRF7822PBF

更新时间: 2024-11-20 04:44:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体转换器晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
6页 144K
描述
HEXFET㈢ Power MOSFET for DC-DC Converters

IRF7822PBF 数据手册

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PD - 95024  
IRF7822PbF  
HEXFET® Power MOSFET for DC-DC Converters  
• N-Channel Application-Specific MOSFETs  
• Ideal for CPU Core DC-DC Converters  
• Low Conduction Losses  
• Low Switching Losses  
• Lead-Free  
A
D
1
2
3
4
8
7
S
S
D
6
5
S
D
D
Description  
G
This new device employs advanced HEXFET Power  
MOSFET technology to achieve an unprecedented  
balance of on-resistance and gate charge. The reduced  
conduction and switching losses make it ideal for high  
efficiency DC-DC converters that power the latest  
generation of microprocessors.  
SO-8  
Top View  
DEVICE CHARACTERISTICSꢀ  
The IRF7822 has been optimized for all parameters that  
are critical in synchronous buck converters including  
IRF7822  
RDS  
QG  
5.0mΩ  
44nC  
12nC  
27nC  
RDS(on), gate charge and Cdv/dt-induced turn-on immunity.  
(on)  
The IRF7822 offers particulary low RDS(on) and high Cdv/  
dt immunity for synchronous FET applications.  
Qsw  
The package is designed for vapor phase, infra-red,  
convection, or wave soldering techniques. Power  
dissipation of greater than 3W is possible in a typical  
PCB mount application.  
Qoss  
Absolute Maximum Ratings  
Parameter  
Symbol  
IRF7822  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
Continuous Drain or Source  
Current (VGS 4.5V)  
Pulsed Drain Current  
Power Dissipation  
VDS  
VGS  
ID  
30  
±12  
V
TA = 25°C  
TA = 70°C  
18  
13  
A
IDM  
PD  
150  
TA = 25°C  
TA = 70°C  
3.1  
W
3.0  
Junction & Storage Temperature Range  
Continuous Source Current (Body Diode)  
Pulsed Source Current  
TJ,TSTG  
IS  
–55 to 150  
3.8  
°C  
A
ISM  
150  
Thermal Resistance  
Parameter  
Max.  
40  
Units  
°C/W  
°C/W  
Maximum Junction-to-Ambientƒ  
Maximum Junction-to-Lead  
RθJA  
RθJL  
20  
www.irf.com  
1
9/30/04  

IRF7822PBF 替代型号

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