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IRF7828TRPBF PDF预览

IRF7828TRPBF

更新时间: 2024-11-20 13:08:47
品牌 Logo 应用领域
英飞凌 - INFINEON 转换器
页数 文件大小 规格书
6页 480K
描述
暂无描述

IRF7828TRPBF 数据手册

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PD - 9460±  
IRF78±8  
HEXFET® Power MOSFET for DC-DC Converters  
• N-Channel Application-Specific MOSFETs  
• Ideal for CPU Core DC-DC Converters  
• Low Conduction Losses  
• Low Switching Losses  
A
D
1
±
3
4
8
7
S
S
D
Description  
6
5
S
D
D
This new device employs advanced HEXFET Power  
MOSFET technology to achieve an unprecedented  
balance of on-resistance and gate charge. The reduced  
conduction and switching losses make it ideal for high  
efficiency DC-DC converters that power the latest  
generation of microprocessors.  
G
SO-8  
Top View  
DEVICE CHARACTERISTICSꢀ  
The IRF78±8 has been optimized for all parameters that  
are critical in synchronous buck converters including  
IRF7828  
RDS(on), gate charge and Cdv/dt-induced turn-on immunity.  
The IRF78±8 offers particulary low RDS(on) and high Cdv/  
dt immunity for synchronous FET applications.  
RDS  
QG  
9.5mΩ  
9.±nC  
3.7nC  
6.1nC  
(on)  
The package is designed for vapor phase, infra-red,  
convection, or wave soldering techniques. Power  
dissipation of greater than 3W is possible in a typical  
PCB mount application.  
Qsw  
Qoss  
Absolute Maximum Ratings  
Parameter  
Symbol  
IRF7828  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
Continuous Drain or Source  
Current (VGS 4.5V)  
Pulsed Drain Current  
Power Dissipation  
VDS  
VGS  
ID  
30  
±±0  
V
TA = ±5°C  
TL = 70°C  
13.6  
11  
A
IDM  
PD  
100  
TA = ±5°C  
TL = 70°C  
±.5  
W
1.6  
Junction & Storage Temperature Range  
Continuous Source Current (Body Diode)  
Pulsed Source Current  
TJ,TSTG  
IS  
–55 to 150  
3.1  
°C  
A
ISM  
100  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambientƒ  
Maximum Junction-to-Lead  
Max.  
50  
Units  
°C/W  
°C/W  
RθJA  
RθJL  
±0  
1±/5/0±  

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