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IRF7726TR PDF预览

IRF7726TR

更新时间: 2024-11-27 12:54:35
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 97K
描述
Ultra Low On-Resistance

IRF7726TR 数据手册

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PD -94064  
IRF7726  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l P-Channel MOSFET  
l Very Small SOIC Package  
l Low Profile (< 1.2mm)  
l Available in Tape & Reel  
VDSS  
-30V  
RDS(on) max  
0.026@VGS = -10V  
0.040@VGS = -4.5V  
ID  
-7.0A  
-6.0A  
Description  
HEXFET® Power MOSFETs from International Recti-  
fierutilizeadvancedprocessingtechniquestoachieve  
extremely low on-resistance per silicon area. This  
benefit, combined with the ruggedized device design,  
that International Rectifier is well known for, provides  
the designer with an extremely efficient and reliable  
device for battery and load management.  
A
1
2
8
D
S
S
7
D
3
4
6
S
D
5
G
D
MICRO-8  
The new Micro8 package, with half the footprint area  
of the standard SO-8, provides the smallest footprint  
available in an SOIC outline. This makes the Micro8  
an ideal device for applications where printed circuit  
boardspaceisatapremium. Thelowprofile(<1.2mm)  
of the Micro8 will allow it to fit easily into extremely thin  
application environments such as portable electronics  
and PCMCIA cards.  
Top View  
Absolute Maximum Ratings  
Parameter  
Drain-Source Voltage  
Max.  
-30  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current  
-7.0  
-5.7  
A
-28  
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipationƒ  
Maximum Power Dissipationƒ  
Linear Derating Factor  
1.79  
W
W
1.14  
0.01  
W/°C  
V
VGS  
Gate-to-Source Voltage  
±20  
TJ , TSTG  
Junction and Storage Temperature Range  
-55 to +150  
°C  
Thermal Resistance  
Parameter  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambientƒ  
70  
°C/W  
www.irf.com  
1
12/21/00  

IRF7726TR 替代型号

型号 品牌 替代类型 描述 数据表
IRF7726TRPBF INFINEON

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