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IRF7738L2TR1PBF PDF预览

IRF7738L2TR1PBF

更新时间: 2024-11-29 21:21:19
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 224K
描述
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

IRF7738L2TR1PBF 数据手册

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IRF7738L2TRPbF  
IRF7738L2TR1PbF  
DirectFET® Power MOSFET ‚  
Features  
V(BR)DSS  
40V  
Advanced Process Technology  
OptimizedforMotorDrive, DC-DCand  
other Heavy Load Applications  
Exceptionally Small Footprint and Low Profile  
High Power Density  
Low Parasitic Parameters  
Dual Sided Cooling  
RDS(on) typ.  
1.2m  
1.6m  
max.  
ID (Silicon Limited)  
Qg  
184A  
129nC  
RepetitiveAvalancheCapabilityforRobustnessand  
Reliability  
Lead free, RoHS Compliant and Halogen free  
S
S
S
S
S
S
D
D
G
DirectFET™ISOMETRIC  
L6  
Applicable DirectFET® Outline and Substrate Outline   
SB  
SC  
M2  
M4  
L4  
L6  
L8  
Description  
The IRF7738L2TR(1)PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® packaging to achieve the lowest on-  
state resistance in a package that has the footprint of a DPak (TO-252AA) and only 0.7 mm profile. The DirectFET package is compatible with existing layout  
geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-  
1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer.  
This HEXFET® Power MOSFET is designed for applications where efficiency and power density are essential. The advanced DirectFET® packaging platform  
coupled with the latest silicon technology allows the IRF7738L2TR(1)PbF to offer substantial system level savings and performance improvement specifically  
in motor drive, high frequency DC-DC and other heavy load applications. This MOSFET utilizes the latest processing techniques to achieve low on-resistance  
and low Qg per silicon area. Additional features of this MOSFET are 175°C operating junction temperature and high repetitive peak current capability. These  
features combine to make this MOSFET a highly efficient, robust and reliable device for high current applications.  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and functional  
operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-maximum-rated conditions  
for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
40  
Parameter  
Units  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
V
V
DS  
GS  
V
± 20  
184  
130  
35  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
I
I
I
@ T = 25°C  
C
D
D
D
@ T = 100°C  
C
A
@ TA = 25°C  
ID @ TC = 25°C  
315  
736  
94  
I
DM  
P
P
@TC = 25°C  
@TA = 25°C  
Power Dissipation  
D
D
W
3.3  
Power Dissipation  
EAS  
134  
538  
Single Pulse Avalanche Energy (Thermally Limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
mJ  
EAS (tested)  
IAR  
A
See Fig.18a, 18b, 16, 17  
270  
EAR  
Repetitive Avalanche Energy  
mJ  
Peak Soldering Temperature  
T
T
T
P
°C  
Operating Junction and  
J
-55 to + 175  
Storage Temperature Range  
STG  
Thermal Resistance  
Parameter  
Typ.  
–––  
12.5  
20  
Max.  
45  
Units  
°C/W  
W/°C  
RJA  
Junction-to-Ambient  
RJA  
Junction-to-Ambient  
Junction-to-Ambient  
Junction-to-Can  
–––  
–––  
1.6  
RJA  
RJCan  
RJ-PCB  
–––  
–––  
Junction-to-PCB Mounted  
Linear Derating Factor  
0.5  
0.63  
HEXFET® is a registered trademark of International Rectifier.  
www.irf.com  
1
February 4, 2013  

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