IRF7738L2TRPbF
IRF7738L2TR1PbF
DirectFET® Power MOSFET
Features
V(BR)DSS
40V
Advanced Process Technology
OptimizedforMotorDrive, DC-DCand
other Heavy Load Applications
Exceptionally Small Footprint and Low Profile
High Power Density
Low Parasitic Parameters
Dual Sided Cooling
RDS(on) typ.
1.2m
1.6m
max.
ID (Silicon Limited)
Qg
184A
129nC
RepetitiveAvalancheCapabilityforRobustnessand
Reliability
Lead free, RoHS Compliant and Halogen free
S
S
S
S
S
S
D
D
G
DirectFETISOMETRIC
L6
Applicable DirectFET® Outline and Substrate Outline
SB
SC
M2
M4
L4
L6
L8
Description
The IRF7738L2TR(1)PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® packaging to achieve the lowest on-
state resistance in a package that has the footprint of a DPak (TO-252AA) and only 0.7 mm profile. The DirectFET package is compatible with existing layout
geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-
1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer.
This HEXFET® Power MOSFET is designed for applications where efficiency and power density are essential. The advanced DirectFET® packaging platform
coupled with the latest silicon technology allows the IRF7738L2TR(1)PbF to offer substantial system level savings and performance improvement specifically
in motor drive, high frequency DC-DC and other heavy load applications. This MOSFET utilizes the latest processing techniques to achieve low on-resistance
and low Qg per silicon area. Additional features of this MOSFET are 175°C operating junction temperature and high repetitive peak current capability. These
features combine to make this MOSFET a highly efficient, robust and reliable device for high current applications.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and functional
operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-maximum-rated conditions
for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Max.
40
Parameter
Units
Drain-to-Source Voltage
Gate-to-Source Voltage
V
V
DS
GS
V
± 20
184
130
35
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
I
I
I
@ T = 25°C
C
D
D
D
@ T = 100°C
C
A
@ TA = 25°C
ID @ TC = 25°C
315
736
94
I
DM
P
P
@TC = 25°C
@TA = 25°C
Power Dissipation
D
D
W
3.3
Power Dissipation
EAS
134
538
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
mJ
EAS (tested)
IAR
A
See Fig.18a, 18b, 16, 17
270
EAR
Repetitive Avalanche Energy
mJ
Peak Soldering Temperature
T
T
T
P
°C
Operating Junction and
J
-55 to + 175
Storage Temperature Range
STG
Thermal Resistance
Parameter
Typ.
–––
12.5
20
Max.
45
Units
°C/W
W/°C
RJA
Junction-to-Ambient
RJA
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Can
–––
–––
1.6
RJA
RJCan
RJ-PCB
–––
–––
Junction-to-PCB Mounted
Linear Derating Factor
0.5
0.63
HEXFET® is a registered trademark of International Rectifier.
www.irf.com
1
February 4, 2013