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IRF7754 PDF预览

IRF7754

更新时间: 2024-11-08 22:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体小信号场效应晶体管开关光电二极管
页数 文件大小 规格书
9页 146K
描述
Power MOSFET(Vdss=-12V)

IRF7754 数据手册

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PD - 94224  
IRF7754  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l P-Channel MOSFET  
l Very Small SOIC Package  
l Low Profile (< 1.2mm)  
l Available in Tape & Reel  
VDSS  
-12V  
RDS(on) max  
ID  
25m@VGS = -4.5V  
34m@VGS = -2.5V  
49m@VGS = -1.8V  
-5.4A  
-4.6A  
-3.9A  
Description  
8
7
6
5
1
2
3
4
HEXFET® Power MOSFETs from International Rectifier  
utilize advanced processing techniques to achieve ex-  
tremely low on-resistance per silicon area. This benefit,  
combined with the ruggedized device design, that Inter-  
nationalRectifier iswellknownfor,providesthedesigner  
with an extremely efficient and reliable device for  
battery and load management.  
1 = D1  
8 = D2  
7 = S2  
6 = S2  
5 = G2  
2 = S1  
3 = S1  
4 = G1  
TSSOP-8  
The TSSOP-8 package has 45% less footprint area than  
the standard SO-8. This makes the TSSOP-8 an ideal  
device for applications where printed circuit board space  
is at a premium. The low profile (<1.2mm) allows it to fit  
easily into extremely thin environments such as portable  
electronics and PCMCIA cards.  
Absolute Maximum Ratings  
Parameter  
Drain-Source Voltage  
Max.  
-12  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ -4.5V  
Continuous Drain Current, VGS @ -4.5V  
Pulsed Drain Current  
-5.5  
-4.4  
A
-22  
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipationƒ  
Maximum Power Dissipationƒ  
Linear Derating Factor  
1
W
W
0.64  
0.01  
±8  
W/°C  
V
VGS  
Gate-to-Source Voltage  
TJ , TSTG  
Junction and Storage Temperature Range  
-55 to +150  
°C  
Thermal Resistance  
Parameter  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambientƒ  
125  
°C/W  
www.irf.com  
1
05/14/01  

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