IRF7769L2PbF
DirectFET Power MOSFET
Typical values (unless otherwise specified)
l RoHS Compliant, Halogen Free
l Lead-Free (Qualified up to 260°C Reflow)
l Ideal for High Performance Isolated Converter
Primary Switch Socket
l Optimized for Synchronous Rectification
l Low Conduction Losses
VDSS
VGS
RDS(on)
2.8mΩ@ 10V
Vgs(th)
100V min ±20V max
Qg tot
Qgd
200nC
110nC
2.7V
l High Cdv/dt Immunity
l Low Profile (<0.7mm)
l Dual Sided Cooling Compatible
l Compatible with existing Surface Mount Techniques
l Industrial Qualified
S
S
S
S
S
S
S
S
G
D
D
DirectFET ISOMETRIC
L8
Applicable DirectFET Outline and Substrate Outline
SB
SC
M2
M4
L4
L6
L8
Description
The IRF7769L2TR/TR1PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to
achieve the lowest on-state resistance in a package that has a footprint smaller than a D2PAK and only 0.7 mm profile. The DirectFET package is
compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering
techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual
sided cooling to maximize thermal transfer in power systems.
The IRF7769L2TR/TR1PbF is optimized for high frequency switching and synchronous rectification applications. The reduced total losses in the
device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability
improvements, and makes this device ideal for high performance power converters.
Standard Pack
Form
Tape and Reel
Tape and Reel
Orderable part number
Package Type
Note
Quantity
4000
1000
IRF7769L2TRPbF
IRF7769L2TR1PbF
DirectFET2 Large Can
DirectFET2 Large Can
"TR" suffix
"TR1" suffix EOL notice # 264
Absolute Maximum Ratings
Parameter
Max.
100
±20
124
88
Units
V
VDS
VGS
Drain-to-Source Voltage
Gate-to-Source Voltage
I
D @ TC = 25°C
ID @ TC = 100°C
D @ TA = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
A
20
I
375
500
260
74
ID @ TC = 25°C
IDM
EAS
IAR
Single Pulse Avalanche Energy
mJ
A
Avalanche Current
12.00
10.00
8.00
6.00
4.00
2.00
0.00
3.10
3.00
2.90
2.80
I
= 74A
T = 25°C
D
A
V
V
= 7.0V
GS
V
= 8.0V
= 10V
GS
T
= 125°C
= 25°C
J
GS
V
= 15V
GS
T
J
2.0
4.0 6.0
8.0 10.0 12.0 14.0 16.0
20
40
60
80
100
V
, Gate-to-Source Voltage (V)
GS
Fig 1. Typical On-Resistance vs. Gate Voltage
I , Drain Current (A)
D
Fig 2. Typical On-Resistance vs. Drain Current
Notes:
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 0.09mH, RG = 25Ω, IAS = 74A.
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
1
www.irf.com © 2014 International Rectifier
Submit Datasheet Feedback
May 6, 2014