PD - 97434
IRF7749L2TRPbF
IRF7749L2TR1PbF
DirectFET Power MOSFET
Typical values (unless otherwise specified)
l RoHS Compliant, Halogen Free
l Lead-Free (Qualified up to 260°C Reflow)
l Ideal for High Performance Isolated Converter
Primary Switch Socket
l Optimized for Synchronous Rectification
VDSS
VGS
RDS(on)
1.1mΩ@ 10V
Vgs(th)
60V min ±20V max
Qg tot
Qgd
l Low Conduction Losses
l High Cdv/dt Immunity
200nC
71nC
2.9V
l Low Profile (<0.7mm)
l Dual Sided Cooling Compatible
l Compatible with existing Surface Mount Techniques
l Industrial Qualified
S
S
S
S
S
S
S
S
G
D
D
DirectFET ISOMETRIC
L8
Applicable DirectFET Outline and Substrate Outline
SB
SC
M2
M4
L4
L6
L8
Description
The IRF7749L2TR/TR1PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to
achieve the lowest on-state resistance in a package that has a footprint smaller than a D2PAK and only 0.7 mm profile. The DirectFET package
is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection
soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package
allows dual sided cooling to maximize thermal transfer in power systems.
The IRF7749L2TR/TR1PbF is optimized for high frequency switching and synchronous rectification applications. The reduced total losses
in the device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system
reliability improvements, and makes this device ideal for high performance power converters.
Absolute Maximum Ratings
Max.
60
Parameter
Units
V
VDS
Drain-to-Source Voltage
Gate-to-Source Voltage
±20
200
140
33
V
GS
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
I
I
I
I
I
@ TC = 25°C
D
D
D
D
A
@ TC = 100°C
@ TA = 25°C
@ TC = 25°C
375
800
260
120
DM
EAS
IAR
Single Pulse Avalanche Energy
mJ
A
Avalanche Current
1.60
1.40
1.20
1.00
0.80
12.0
10.0
8.0
V
V
V
V
= 6.0V
= 8.0V
= 10V
= 14V
T
= 25°C
I
= 120A
GS
GS
GS
GS
C
D
6.0
T
T
= 25°C
J
4.0
= 125°C
J
2.0
0.0
4.0
6.0
V
8.0
10.0 12.0 14.0 16.0
40
80
120
160
200
, Gate-to-Source Voltage (V)
GS
I , Drain Current (A)
D
Fig 1. Typical On-Resistance vs. Gate Voltage
Fig 2. Typical On-Resistance vs. Drain Current
Notes:
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 0.035mH, RG = 25Ω, IAS = 120A.
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
www.irf.com
1
11/17/09