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IRF7751GPBF PDF预览

IRF7751GPBF

更新时间: 2024-11-27 05:39:27
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 237K
描述
HEXFET® Power MOSFET Ultra Low On-Resistance

IRF7751GPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:HALOGEN AND LEAD FREE, TSSOP-8Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.37
其他特性:HIGH RELIABILITY配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):4.5 A
最大漏极电流 (ID):4.5 A最大漏源导通电阻:0.035 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:MO-153AA
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
湿度敏感等级:2元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):1 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:MATTE TIN端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF7751GPBF 数据手册

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PD - 96145A  
IRF7751GPbF  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l Dual P-Channel MOSFET  
l Very Small SOIC Package  
l Low Profile (< 1.2mm)  
l Available in Tape & Reel  
l Lead-Free  
VDSS  
-30V  
RDS(on) max  
35m@VGS = -10V  
55m@VGS = -4.5V  
ID  
-4.5A  
-3.8A  
l Halogen-Free  
Description  
HEXFET® power MOSFETs from International Rectifier  
utilize advanced processing techniques to achieve ex-  
tremely low on-resistance per silicon area. This benefit,  
combined with the ruggedized device design, that Inter-  
national Rectifier is well known for, provides the de-  
signer with an extremely efficient and reliable device  
for use in battery and load management.  
TSSOP-8  
The TSSOP-8 package has 45% less footprint area than  
the standard SO-8. This makes the TSSOP-8 an ideal  
device for applications where printed circuit board space  
is at a premium. The low profile (<1.2mm) allows it to fit  
easily into extremely thin environments such as portable  
electronics and PCMCIA cards.  
Absolute Maximum Ratings  
Parameter  
Drain-Source Voltage  
Max.  
-30  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current   
-4.5  
-3.6  
A
-18  
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation ƒ  
Power Dissipation ƒ  
1.0  
W
0.64  
Linear Derating Factor  
0.008  
±20  
W/°C  
V
VGS  
Gate-to-Source Voltage  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to +150  
°C  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambientƒ  
Max.  
125  
Units  
°C/W  
RθJA  
www.irf.com  
1
05/14/09  

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