IRF7749L1TRPbF
Applications
l RoHS Compliant, Halogen Free
l Lead-Free (Qualified up to 260°C Reflow)
DirectFET Power MOSFET
Typical values (unless otherwise specified)
VDSS
VGS
RDS(on)
1.1mΩ@ 10V
Vgs(th)
l Ideal for High Performance Isolated Converter
Primary Switch Socket
l Optimized for Synchronous Rectification
60V min ±20V max
Qg tot
Qgd
l Low Conduction Losses
200nC
71nC
2.9V
l High Cdv/dt Immunity
l Low Profile (<0.7mm)
S
S
S
S
S
S
S
S
l Dual Sided Cooling Compatible
l Compatible with existing Surface Mount Techniques
l Industrial Qualified
G
D
D
DirectFET ISOMETRIC
L8
Applicable DirectFET Outline and Substrate Outline
SB
SC
M2
M4
L4
L6
L8
Description
The IRF7749L1TRPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the
lowest on-state resistance in a package that has a footprint smaller than a D2PAK and only 0.7 mm profile. The DirectFET package is compatible
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,
when application noteAN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling
to maximize thermal transfer in power systems.
The IRF7749L1TRPbF is optimized for high frequency switching and synchronous rectification applications. The reduced total losses in the device
coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability improvements,
and makes this device ideal for high performance power converters.
Ordering Information
Standard Pack
Base part number
Package Type
Orderable Part Number
Form
Tape and Reel
Quantity
4000
IRF7749L1TRPbF
DirectFET Large Can
IRF7749L1TRPbF
Absolute Maximum Ratings
Max.
60
Parameter
Units
V
VDS
Drain-to-Source Voltage
Gate-to-Source Voltage
±20
200
140
33
V
GS
(Silicon Limited)
(Silicon Limited)
(Silicon Limited)
(Package Limited)
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
I
I
@ TC = 25°C
D
D
D
D
A
@ TC = 100°C
@ TA = 25°C
@ TC = 25°C
375
800
260
120
DM
EAS
IAR
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
1.60
1.40
1.20
1.00
0.80
12.0
10.0
8.0
V
V
V
V
= 6.0V
= 8.0V
= 10V
= 14V
T
= 25°C
I
= 120A
GS
GS
GS
GS
C
D
6.0
T
T
= 25°C
J
4.0
= 125°C
J
2.0
0.0
40
80
120
160
200
4.0
6.0
V
8.0
10.0 12.0 14.0 16.0
I
, Drain Current (A)
, Gate-to-Source Voltage (V)
D
GS
Fig 1. Typical On-Resistance vs. Gate Voltage
Fig 2. Typical On-Resistance vs. Drain Current
Notes:
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 0.035mH, RG = 25Ω, IAS = 120A.
1
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© 2012 International Rectifier
February 18, 2013