IRF7739L1TRPbF
Applications
DirectFET Power MOSFET
Typical values (unless otherwise specified)
l RoHS Compliant, Halogen Free
l Lead-Free (Qualified up to 260°C Reflow)
l Ideal for High Performance Isolated Converter
Primary Switch Socket
VDSS
VGS
RDS(on)
0.70mΩ@ 10V
Vgs(th)
40V min ±20V max
Qg tot
Qgd
l Optimized for Synchronous Rectification
220nC
81nC
2.8V
l Low Conduction Losses
l High Cdv/dt Immunity
S
S
S
S
l Low Profile (<0.7mm)
S
S
S
S
l Dual Sided Cooling Compatible
l Compatible with existing Surface Mount Techniques
l Industrial Qualified
D
D
G
DirectFET ISOMETRIC
L8
Applicable DirectFET Outline and Substrate Outline
SB
SC
M2
M4
L4
L6
L8
Description
The IRF7739L1TRPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve
the lowest on-state resistance in a package that has a footprint smaller than a D2PAK and only 0.7 mm profile. The DirectFET package is compatible
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,
when application note AN-1035is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling
to maximize thermal transfer in power systems.
The IRF7739L1TRPbF is optimized for high frequency switching and synchronous rectification applications. The reduced total losses in the
device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability
improvements, and makes this device ideal for high performance power converters.
Ordering Information
Standard Pack
Base part number
Package Type
Orderable Part Number
Form
Tape and Reel
Quantity
4000
IRF7739L1TRPbF
DirectFET Large Can
IRF7739L1TRPbF
Absolute Maximum Ratings
Max.
40
Parameter
Units
V
VDS
Drain-to-Source Voltage
Gate-to-Source Voltage
±20
270
190
46
V
GS
(Silicon Limited)
(Silicon Limited)
(Silicon Limited)
(Package Limited)
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
I
I
@ TC = 25°C
D
D
D
D
@ TC = 100°C
@ TA = 25°C
@ TC = 25°C
A
375
1070
270
160
DM
EAS
IAR
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
10
8
0.93
0.92
0.91
0.90
0.89
0.88
0.87
0.86
0.85
V
= 10V
I
= 160A
GS
D
T
= 25°C
J
6
4
T
= 125°C
7.5
J
2
0
5.0
5.5
V
6.0
6.5
7.0
8.0
0
40
80
120
160
200
I
, Drain Current (A)
D
Gate -to -Source Voltage (V)
GS,
Fig 1. Typical On-Resistance vs. Gate Voltage
Fig 2. Typical On-Resistance vs. Drain Current
Notes:
Click on the hyperlink (to the relevant technical document) for more details.
Click on the hyperlink (to the DirectFET website) for more details
Surface mounted on 1 in. square Cu board, steady state.
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 0.021mH, RG = 25Ω, IAS = 160A.
1
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© 2012 International Rectifier
February 13 ,2013