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IRF7703TR PDF预览

IRF7703TR

更新时间: 2024-09-16 21:13:19
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲光电二极管晶体管
页数 文件大小 规格书
9页 134K
描述
Power Field-Effect Transistor, 6A I(D), 40V, 0.028ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, MO-153AA, TSSOP-8

IRF7703TR 数据手册

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PD - 94221  
IRF7703  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l P-Channel MOSFET  
l Very Small SOIC Package  
l Low Profile (< 1.2mm)  
l Available in Tape & Reel  
VDSS  
-40V  
RDS(on) max (mΩ)  
28@VGS = -10V  
ID  
-6.0A  
45@VGS = -4.5V  
-4.8A  
Description  
1
2
3
4
8
7
6
5
D
S
HEXFET® Power MOSFETs from International Rectifier  
utilize advanced processing techniques to achieve ex-  
tremely low on-resistance per silicon area. This benefit,  
combined with the ruggedized device design, that Inter-  
national Rectifier is well known for, provides the de-  
signer with an extremely efficient and reliable device  
for battery and load management.  
G
1 =  
D
S
S
8 =  
7 =  
6 =  
5 =  
D
S
S
2 =  
3 =  
4 =  
G
D
TSSOP-8  
The TSSOP-8 package has 45% less footprint area than  
the standard SO-8. This makes the TSSOP-8 an ideal  
device for applications where printed circuit board space  
is at a premium. The low profile (<1.2mm) allows it to fit  
easily into extremely thin environments such as portable  
electronics and PCMCIA cards.  
Absolute Maximum Ratings  
Parameter  
Drain- Source Voltage  
Max.  
-40  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current   
-6.0  
-4.7  
-24  
A
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation ƒ  
1.5  
W
Power Dissipation ƒ  
0.96  
0.012  
± 20  
Linear Derating Factor  
W/°C  
V
VGS  
Gate-to-Source Voltage  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambientƒ  
Max.  
83  
Units  
°C/W  
RθJA  
www.irf.com  
1
05/11/01  

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