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IRF7706GTRPBF PDF预览

IRF7706GTRPBF

更新时间: 2024-11-05 22:58:51
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 234K
描述
MOSFET P-CH 30V 7A 8-TSSOP

IRF7706GTRPBF 数据手册

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PD-96143A  
IRF7706GPbF  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l P-Channel MOSFET  
l Very Small SOIC Package  
l Low Profile (< 1.2mm)  
l Available in Tape & Reel  
l Lead-Free  
VDSS  
-30V  
RDS(on) max  
22m@VGS = -10V  
36m@VGS = -4.5V  
ID  
-7.0A  
-5.6A  
l Halogen-Free  
Description  
HEXFET® Power MOSFETs from International Rectifier  
utilize advanced processing techniques to achieve ex-  
tremely low on-resistance per silicon area. This benefit,  
combined with the ruggedized device design, that Inter-  
national Rectifier is well known for, provides the de-  
signer with an extremely efficient and reliable device  
for battery and load management.  
TSSOP-8  
The TSSOP-8 package has 45% less footprint area than  
the standard SO-8. This makes the TSSOP-8 an ideal  
device for applications where printed circuit board space  
is at a premium. The low profile (<1.2mm) allows it to fit  
easily into extremely thin environments such as portable  
electronics and PCMCIA cards.  
Absolute Maximum Ratings  
Parameter  
Drain-Source Voltage  
Max.  
-30  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current  
-7.0  
-5.7  
A
-28  
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipationƒ  
Maximum Power Dissipationƒ  
Linear Derating Factor  
1.51  
W
W
0.96  
0.01  
W/°C  
V
VGS  
Gate-to-Source Voltage  
± 20  
TJ , TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambientƒ  
Max.  
83  
Units  
°C/W  
RθJA  
www.irf.com  
1
05/15/09  

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