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IRF7343PBF PDF预览

IRF7343PBF

更新时间: 2024-11-07 04:44:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲光电二极管局域网
页数 文件大小 规格书
10页 220K
描述
HEXFET Power MOSFET

IRF7343PBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, SO-8Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:7.83
其他特性:AVALANCHE RATED, HIGH RELIABILITY雪崩能效等级(Eas):72 mJ
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:55 V
最大漏极电流 (ID):4.7 A最大漏源导通电阻:0.05 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:MS-012AA
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL AND P-CHANNEL最大功率耗散 (Abs):2 W
最大脉冲漏极电流 (IDM):38 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF7343PBF 数据手册

 浏览型号IRF7343PBF的Datasheet PDF文件第2页浏览型号IRF7343PBF的Datasheet PDF文件第3页浏览型号IRF7343PBF的Datasheet PDF文件第4页浏览型号IRF7343PBF的Datasheet PDF文件第5页浏览型号IRF7343PBF的Datasheet PDF文件第6页浏览型号IRF7343PBF的Datasheet PDF文件第7页 
PD - 92547  
IRF7343PbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l Dual N and P Channel MOSFET  
l Surface Mount  
l Fully Avalanche Rated  
l Lead-Free  
N-CHANNEL MOSFET  
N-Ch P-Ch  
1
8
D1  
D1  
S1  
G1  
2
7
VDSS 55V  
-55V  
3
4
6
5
S2  
G2  
D2  
D2  
P-CHANNEL MOSFET  
RDS(on) 0.0500.105Ω  
Description  
Top View  
FifthGenerationHEXFETsfromInternationalRectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in a wide variety of applications.  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of  
power applications. With these improvements,  
multiple devices can be used in an application with  
dramatically reduced board space. The package is  
designed for vapor phase, infra red, or wave soldering  
techniques.  
SO-8  
Absolute Maximum Ratings  
Max.  
Parameter  
N-Channel  
P-Channel  
-55  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Drain-Source Voltage  
55  
4.7  
3.8  
38  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
-3.4  
-2.7  
-27  
A
PD@TA = 25°C  
PD@TA = 70°C  
Maximum Power Dissipation  
Maximum Power Dissipation ꢀ  
Single Pulse Avalanche Energyƒ  
Avalanche Current  
2.0  
1.3  
W
W
EAS  
72  
114  
-3.4  
mJ  
A
IAR  
4.7  
EAR  
Repetitive Avalanche Energy  
Gate-to-Source Voltage  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
0.20  
± 20  
mJ  
V
V/ns  
°C  
VGS  
dv/dt  
TJ,TSTG  
5.0  
-5.0  
-55 to + 150  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambient ꢀ  
Typ.  
–––  
Max.  
62.5  
Units  
°C/W  
RθJA  
www.irf.com  
1
10/7/04  

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