PD- 91802A
IRF7353D1
FETKY MOSFET / Schottky Diode
● Co-packaged HEXFET® Power MOSFET
and Schottky Diode
● Ideal For Buck Regulator Applications
● N-Channel HEXFET
● Low VF Schottky Rectifier
● Generation 5 Technology
● SO-8 Footprint
1
8
7
K
K
A
VDSS = 30V
2
A
R
DS(on) = 0.029Ω
3
4
6
5
S
D
D
G
Schottky Vf = 0.39V
Top View
Description
The FETKY family of co-packaged MOSFETs and Schottky diodes offers the
designer an innovative, board space saving solution for switching regulator
and power management applications. Generation 5 HEXFET Power
MOSFETs utilize advanced processing techniques to achieve extremely low
on-resistance per silicon area. Combinining this technology with
International Rectifier's low forward drop Schottky rectifiers results in an
extremely efficient device suitable for use in a wide variety of portable
electronics applications.
S O -8
The SO-8 has been modified through a customized leadframe for
enhanced thermal characteristics. The SO-8 package is designed for vapor
phase, infrared or wave soldering techniques.
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Parameter
Maximum
Units
ID @ TA = 25°C
ID @ TA = 70°C
IDM
Continuous Drain Current ➃
6.5
A
5.2
Pulsed Drain Current ➀
Power Dissipation ➃
52
PD @TA = 25°C
PD @TA = 70°C
2.0
W
1.3
Linear Derating Factor
16
mW/°C
V
VGS
Gate-to-Source Voltage
± 20
-5.0
dv/dt
Peak Diode Recovery dv/dt ➁
Junction and Storage Temperature Range
V/ns
°C
TJ, TSTG
-55 to +150
Thermal Resistance Ratings
Parameter
Maximum
Units
RθJA
Junction-to-Ambient ꢀ
62.5
°C/W
Notes:
➀ Repetitive rating; pulse width limited by maximum junction temperature (see figure 9)
➁ Starting TJ = 25°C, L = 10mH, RG = 25Ω, IAS = 4.0A
➂ ISD ≤ 4.0A, di/dt ≤ 74A/µs, VDD ≤ V(BR)DSS, TJ ≤ 150°C
➃ Pulse width ≤ 300µs; duty cycle ≤ 2%
ꢀ Surface mounted on FR-4 board, t ≤ 10sec.
www.irf.com
1
3/17/99