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IRF737LC PDF预览

IRF737LC

更新时间: 2024-10-29 22:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 145K
描述
HEXFET?? Power MOSFET

IRF737LC 数据手册

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PD - 9.1314  
IRF737LC  
PRELIMINARY  
HEXFET® Power MOSFET  
Reduced Gate Drive Requirement  
Enhanced 30V VGS Rating  
Reduced CISS, COSS, CRSS  
Extremely High Frequency Operation  
Repetitive Avalanche Rated  
VDSS = 300V  
RDS(on) = 0.75Ω  
ID = 6.1A  
Description  
This new series of Low Charge HEXFETs achieve  
significantlylowergatechargeoverconventionalMOSFETs.  
Utilizing the new LCDMOS technology, the device  
improvements are achieved without added product cost,  
allowing for reduced gate drive requirements and total  
system savings. In addition, reduced switching losses and  
improved efficiency are achievable in a variety of high  
frequency applications. Frequencies of a few MHz at high  
current are possible using the new Low Charge MOSFETs.  
These device improvements combined with the proven  
ruggedness and reliability that are characteristics of  
HEXFETs offer the designer a new standard in power  
transistors for switching applications.  
Absolute Maximum Ratings  
Parameter  
Max.  
6.1  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
3.9  
A
24  
PD @TC = 25°C  
Power Dissipation  
74  
W
W/°C  
V
Linear Derating Factor  
0.59  
±30  
120  
6.1  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
7.4  
mJ  
V/ns  
3.4  
-55 to + 150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw.  
°C  
300 (1.6mm from case)  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Min.  
––––  
––––  
––––  
Typ.  
––––  
0.50  
Max.  
Units  
RθJC  
RθCS  
RθJA  
1.7  
––––  
62  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
°C/W  
––––  

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