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IRF7343QTRPBF PDF预览

IRF7343QTRPBF

更新时间: 2024-09-17 13:08:47
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管开关脉冲光电二极管局域网
页数 文件大小 规格书
10页 145K
描述
Transistor,

IRF7343QTRPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.79最大漏极电流 (Abs) (ID):4.7 A
FET 技术:METAL-OXIDE SEMICONDUCTOR工作模式:ENHANCEMENT MODE
最高工作温度:150 °C极性/信道类型:N-CHANNEL AND P-CHANNEL
最大功率耗散 (Abs):2 W子类别:Other Transistors
表面贴装:YESBase Number Matches:1

IRF7343QTRPBF 数据手册

 浏览型号IRF7343QTRPBF的Datasheet PDF文件第2页浏览型号IRF7343QTRPBF的Datasheet PDF文件第3页浏览型号IRF7343QTRPBF的Datasheet PDF文件第4页浏览型号IRF7343QTRPBF的Datasheet PDF文件第5页浏览型号IRF7343QTRPBF的Datasheet PDF文件第6页浏览型号IRF7343QTRPBF的Datasheet PDF文件第7页 
PD-91709  
IRF7343  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l Dual N and P Channel MOSFET  
l Surface Mount  
N -C H A N N EL M O S FE T  
N-Ch P-Ch  
1
8
D 1  
D 1  
S1  
G 1  
2
7
VDSS 55V  
-55V  
3
4
6
5
S2  
D 2  
D 2  
l Fully Avalanche Rated  
G 2  
P -C H A N N E L M O S F E T  
RDS(on) 0.0500.105Ω  
Description  
Top View  
FifthGenerationHEXFETsfromInternationalRectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in a wide variety of applications.  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of  
power applications. With these improvements,  
multiple devices can be used in an application with  
dramatically reduced board space. The package is  
designed for vapor phase, infra red, or wave soldering  
techniques.  
S O -8  
Absolute Maximum Ratings  
Max.  
Parameter  
N-Channel  
P-Channel  
-55  
Units  
V
VDS  
Drain-Source Voltage  
55  
4.7  
3.8  
38  
ID @ TA = 25°C  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
-3.4  
A
ID @ TA = 70°C  
-2.7  
IDM  
-27  
PD@TA = 25°C  
PD@TA = 70°C  
Maximum Power Dissipation  
Maximum Power Dissipation ꢀ  
Single Pulse Avalanche Energyƒ  
Avalanche Current  
2.0  
1.3  
W
W
EAS  
72  
114  
-3.4  
mJ  
A
IAR  
4.7  
EAR  
Repetitive Avalanche Energy  
Gate-to-Source Voltage  
Peak Diode Recovery dv/dt ‚  
0.20  
± 20  
mJ  
V
V/ns  
°C  
VGS  
dv/dt  
TJ,TSTG  
5.0  
-5.0  
Junction and Storage Temperature Range  
-55 to + 150  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambient ꢀ  
Typ.  
–––  
Max.  
62.5  
Units  
°C/W  
RθJA  
www.irf.com  
1
2/24/99  

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