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IRF7316QTRPBF PDF预览

IRF7316QTRPBF

更新时间: 2024-09-28 14:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
7页 218K
描述
Transistor,

IRF7316QTRPBF 技术参数

是否Rohs认证:符合生命周期:Active
Reach Compliance Code:compliant风险等级:5
Is Samacsys:N最大漏极电流 (Abs) (ID):4.9 A
FET 技术:METAL-OXIDE SEMICONDUCTOR工作模式:ENHANCEMENT MODE
最高工作温度:150 °C极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):2 W子类别:Other Transistors
表面贴装:YESBase Number Matches:1

IRF7316QTRPBF 数据手册

 浏览型号IRF7316QTRPBF的Datasheet PDF文件第2页浏览型号IRF7316QTRPBF的Datasheet PDF文件第3页浏览型号IRF7316QTRPBF的Datasheet PDF文件第4页浏览型号IRF7316QTRPBF的Datasheet PDF文件第5页浏览型号IRF7316QTRPBF的Datasheet PDF文件第6页浏览型号IRF7316QTRPBF的Datasheet PDF文件第7页 
PD - 96126A  
IRF7316QPbF  
HEXFET® Power MOSFET  
l
l
l
l
l
l
l
Advanced Process Technology  
UltraLowOn-Resistance  
Dual P- Channel MOSFET  
SurfaceMount  
Available in Tape & Reel  
150°COperatingTemperature  
Lead-Free  
1
2
3
4
8
S1  
G1  
D1  
VDSS = -30V  
7
D1  
6
S2  
D2  
5
G2  
D2  
RDS(on) = 0.058Ω  
Top View  
Description  
These HEXFET® Power MOSFET's in a Dual  
SO-8 package utilize the lastest processing  
techniques to achieve extremely low on-  
resistanceper silicon area. Additionalfeatures  
oftheseHEXFETPowerMOSFET'sarea150°C  
junction operating temperature, fast switching  
speedandimprovedrepetitiveavalancherating.  
These benefits combine to make this design an  
extremelyefficientandreliabledeviceforusein  
a wide variety of applications.  
TheefficientSO-8packageprovidesenhanced  
thermal characteristics and dual MOSFET die  
capability making it ideal in a variety of power  
applications. This dual, surface mount SO-8  
candramaticallyreduceboardspaceandisalso  
available in Tape & Reel.  
SO-8  
Absolute Maximum Ratings ( TA = 25°C Unless Otherwise Noted)  
Symbol  
VDS  
Maximum  
-30  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
± 20  
TA = 25°C  
TA = 70°C  
-4.9  
-3.9  
-30  
-2.5  
Continuous Drain Current  
ID  
A
Pulsed Drain Current  
IDM  
IS  
Continuous Source Current (Diode Conduction)  
TA = 25°C  
TA = 70°C  
2.0  
1.3  
Maximum Power Dissipation ꢀ  
PD  
W
Single Pulse Avalanche Energy  
Avalanche Current  
EAS  
IAR  
140  
mJ  
A
-2.8  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Junction and Storage Temperature Range  
EAR  
0.20  
mJ  
V/ ns  
°C  
dv/dt  
TJ,TSTG  
-5.0  
-55 to + 150  
Thermal Resistance Ratings  
Parameter  
Symbol  
Limit  
Units  
Maximum Junction-to-Ambientꢀ  
RθJA  
62.5  
°C/W  
www.irf.com  
1
08/02/10  

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