PD - 97282
DIGITAL AUDIO MOSFET
IRF6785MTRPbF
Key Parameters
Features
• Latest MOSFET Silicon technology
VDS
200
V
• Key parameters optimized for Class-D audio amplifier
applications
• Low RDS(on) for improved efficiency
m:
nC
RDS(on) typ. @ VGS = 10V
Qg typ.
85
26
• Low Qg for better THD and improved efficiency
• Low Qrr for better THD and lower EMI
• Low package stray inductance for reduced ringing and lower
EMI
RG(int) max
3.0
• Can deliver up to 250W per channel into 8Ω Load in
Half-Bridge Configuration Amplifier
• Dual sided cooling compatible
· Compatible with existing surface mount technologies
· RoHS compliant containing no lead or bromide
·Lead-Free (Qualified up to 260°C Reflow)
DirectFET ISOMETRIC
MZ
Applicable DirectFET Outline and Substrate Outline (see p. 6, 7 for details)
SQ SX ST SH MQ MX MT
MN
MZ
Description
This Digital Audio MOSFET is specifically designed for Class-D audio amplifier applications. This MOSFET utilizes the
latest processing techniques to achieve low on-resistance per silicon area. Furthermore, gate charge, body-diode reverse
recovery and internal gate resistance are optimized to improve key Class-D audio amplifier performance factors such as
efficiency, THD, and EMI.
The IRF6785MPbF device utilizes DirectFETTM packaging technology. DirectFETTM packaging technology offers lower parasitic
inductance and resistance when compared to conventional wirebonded SOIC packaging. Lower inductance improves EMI
performance by reducing the voltage ringing that accompanies fast current transients. The DirectFETTM package is compatible
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection
soldering techniques, when application note AN-1035 is followed regarding the manufacturing method and processes. The
DirectFETTM package also allows dual sided cooling to maximize thermal transfer in power systems, improving thermal resis-
tance and power dissipation. These features combine to make this MOSFET a highly efficient, robust and reliable device for
Class-D audio amplifier applications.
Absolute Maximum Ratings
Parameter
Drain-to-Source Voltage
Max.
200
Units
V
VDS
VGS
Gate-to-Source Voltage
± 20
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
@ TC = 25°C
@ T = 25°C
A
19
3.4
D
D
A
I
I
@ T = 70°C
A
2.7
27
D
DM
P
P
P
@TC = 25°C
@TA = 25°C
@TA = 70°C
Maximum Power Dissipation
Power Dissipation
57
2.8
1.8
33
W
D
D
D
Power Dissipation
EAS
IAR
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
8.4
Linear Derating Factor
Operating Junction and
0.022
-40 to + 150
W/°C
°C
T
J
T
Storage Temperature Range
STG
Thermal Resistance
Parameter
Junction-to-Ambient
Typ.
Max.
Units
Rθ
JA
–––
12.5
20
45
°C/W
Rθ
JA
Junction-to-Ambient
–––
–––
1.4
Rθ
JA
Junction-to-Ambient
Rθ
JC
Junction-to-Case
–––
1.4
Rθ
J-PCB
Junction-to-PCB Mounted
–––
Notes through are on page 2
www.irf.com
1
04/18/07