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HUF75631S3ST PDF预览

HUF75631S3ST

更新时间: 2024-11-13 22:22:51
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关
页数 文件大小 规格书
10页 202K
描述
33A, 100V, 0.040 Ohm, N-Channel, UltraFET Power MOSFETs

HUF75631S3ST 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:D2PAK
针数:2Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.33Is Samacsys:N
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):33 A
最大漏极电流 (ID):33 A最大漏源导通电阻:0.04 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):120 W认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

HUF75631S3ST 数据手册

 浏览型号HUF75631S3ST的Datasheet PDF文件第2页浏览型号HUF75631S3ST的Datasheet PDF文件第3页浏览型号HUF75631S3ST的Datasheet PDF文件第4页浏览型号HUF75631S3ST的Datasheet PDF文件第5页浏览型号HUF75631S3ST的Datasheet PDF文件第6页浏览型号HUF75631S3ST的Datasheet PDF文件第7页 
HUF75631P3, HUF75631S3ST  
Data Sheet  
December 2001  
33A, 100V, 0.040 Ohm, N-Channel,  
UltraFET® Power MOSFETs  
Packaging  
JEDEC TO-220AB  
JEDEC TO-263AB  
Features  
DRAIN  
SOURCE  
DRAIN  
GATE  
(FLANGE)  
• Ultra Low On-Resistance  
- r  
= 0.040Ω, VGS = 10V  
DS(ON)  
GATE  
• Simulation Models  
SOURCE  
- Temperature Compensated PSPICE® and SABER™  
Electrical Models  
DRAIN  
(FLANGE)  
- Spice and SABER Thermal Impedance Models  
- www.fairchildsemi.com  
HUF75631P3  
HUF75631S3ST  
• Peak Current vs Pulse Width Curve  
• UIS Rating Curve  
Symbol  
Ordering Information  
D
S
PART NUMBER  
PACKAGE  
TO-220AB  
TO-263AB  
BRAND  
75631P  
75631S  
HUF75631P3  
G
HUF75631S3ST  
NOTE: When ordering, use the entire part number, e.g.,  
HUF75631S3ST.  
o
Absolute Maximum Ratings  
T = 25 C, Unless Otherwise Specified  
C
HUF75631P3  
HUF75631S3ST  
UNITS  
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
100  
100  
±20  
V
V
V
DSS  
Drain to Gate Voltage (R  
= 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GS  
DGR  
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GS  
Drain Current  
o
Continuous (T = 25 C, V  
C
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
33  
23  
A
A
GS  
D
D
o
Continuous (T = 100 C, V  
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
C
GS  
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
Figure 4  
DM  
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS  
Figures 6, 14, 15  
Power Dissipation 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
120  
0.80  
W
W/ C  
D
o
o
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T  
J
-55 to 175  
C
STG  
Maximum Temperature for Soldering  
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
o
300  
260  
C
C
L
o
pkg  
NOTE:  
1. T = 25 C to 150 C.  
o
o
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
Product reliability information can be found at http://www.fairchildsemi.com/products/discrete/reliability/index.html  
For severe environments, see our Automotive HUFA series.  
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.  
©2001 Fairchild Semiconductor Corporation  
HUF75631P3, HUF75631S3ST Rev. B  

HUF75631S3ST 替代型号

型号 品牌 替代类型 描述 数据表
STB35NF10T4 STMICROELECTRONICS

功能相似

N-channel 100V - 0.030Ω - 40A - D2PAK/TO-220
STB30NF10T4 STMICROELECTRONICS

功能相似

N-channel 100V - 0.038ヘ - 35A - D2PAK/TO-220/

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