Datasheet > HMC635-Die

HMC635-Die

更新时间： 2023-12-20 18:45:20

品牌	Logo	应用领域
亚德诺 - ADI		放大器驱动
页数	文件大小	规格书
8页	400K
描述
驱动放大器芯片，18 - 40 GHz

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HMC635-Die 数据手册

HMC635

v00.1107

GaAs PHEMT MMIC DRIVER

AMPLIFIER, 18 - 40 GHz

Outline Drawing

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS .004”

3. TYPICAL BOND IS .004” SQUARE

4. BACKSIDE METALLIZATION: GOLD

5. BOND PAD METALLIZATION: GOLD

6. BACKSIDE METAL IS GROUND.

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

Die Packaging Information ^[1]

Standard

Alternate

GP-2 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

For price, delivery, and to place orders, please co^Fn^ota^rc^prt^icH^e,it^dti^et^le^iveM^ry,ic^arⁿo^dw^toav^pe^lacC^eo^or^rdp^eo^rsr^:a^Atiⁿo^an^lo:^{g Devices, Inc.,}

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106

Phone: 781-329-4700 • Order online at www.analog.com

Application Support: Phone: 1-800-ANALOG-D

rights of third parties that may result from its use. Specifications subject to change without notice. No

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

2 - 62

^{Trademarks and registered trademarks are the property of their re}O^sper^cd^tive^er^owO^nen^rs-^.line at www.hittite.com

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