HGTG20N100D2
20A, 1000V N-Channel IGBT
May 1995
Features
Package
JEDEC STYLE TO-247
• 34A, 1000V
EMITTER
• Latch Free Operation
• Typical Fall Time 520ns
• High Input Impedance
• Low Conduction Loss
COLLECTOR
GATE
COLLECTOR
(BOTTOM SIDE
METAL)
Description
The HGTG20N100D2 is a MOS gated high voltage switching
device combining the best features of MOSFETs and bipolar
transistors. The device has the high input impedance of a MOS-
FET and the low on-state conduction loss of a bipolar transistor.
The much lower on-state voltage drop varies only moderately
between +25oC and +150oC.
Terminal Diagram
N-CHANNEL ENHANCEMENT MODE
IGBTs are ideal for many high voltage switching applications
operating at frequencies where low conduction losses are essen-
tial, such as: AC and DC motor controls, power supplies and
drivers for solenoids, relays and contactors.
C
PACKAGING AVAILABILITY
G
PART NUMBER
PACKAGE
TO-247
BRAND
HGTG20N100D2
G20N100D2
E
o
Absolute Maximum Ratings T = +25 C, Unless Otherwise Specified
C
HGTG20N100D2
UNITS
Collector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BV
1000
1000
34
V
V
A
A
A
V
V
-
CES
Collector-Gate Voltage R = 1MΩ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BV
GE
CGR
o
Collector Current Continuous at T = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
C
C25
o
at T = +90 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
20
C
C90
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
100
±20
±30
CM
GES
GEM
Gate-Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Gate-Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
o
Switching Safe Operating Area at T = +150 C . . . . . . . . . . . . . . . . . . . . . . . . . . . .SSOA
100A at 0.8 BV
150
J
o
CES
Power Dissipation Total at T = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
W
C
D
o
o
Power Dissipation Derating T > +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.20
W/ C
C
o
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . .T , T
-55 to +150
260
C
J
STG
o
Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
(0.125 inch from case for 5 seconds)
C
L
Short Circuit Withstand Time (Note 2) at V = 15V. . . . . . . . . . . . . . . . . . . . . . . . . . t
3
µs
µs
GE
SC
SC
at V = 10V. . . . . . . . . . . . . . . . . . . . . . . . . . t
15
GE
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
o
2. V
= 600V, T = +125 C, R = 25Ω.
CE(PEAK)
C
GE
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS:
4,364,073
4,417,385
4,598,461
4,644,637
4,801,986
4,883,767
4,430,792
4,605,948
4,682,195
4,803,533
4,888,627
4,443,931
4,618,872
4,684,413
4,809,045
4,890,143
4,466,176
4,620,211
4,694,313
4,809,047
4,901,127
4,516,143
4,631,564
4,717,679
4,810,665
4,904,609
4,532,534
4,639,754
4,743,952
4,823,176
4,933,740
4,567,641
4,639,762
4,783,690
4,837,606
4,963,951
4,587,713
4,641,162
4,794,432
4,860,080
4,969,027
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
File Number 2826.3
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3-93